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1. 发明授权

US08968485B2 Apparatus and methods for processing a substrate 有权
标题翻译：用于处理衬底的装置和方法
公开(公告)号：US08968485B2
公开(公告)日：2015-03-03
申请号：US13251064
申请日：2011-09-30
申请人： Arjun Mendiratta , Cheng-Yu Lin , David Mui
发明人： Arjun Mendiratta , Cheng-Yu Lin , David Mui
IPC分类号： B08B3/00 , B08B1/02 , B08B3/04 , H01L21/02 , H01L21/67
CPC分类号： B08B1/02 , B08B3/04 , H01L21/02065 , H01L21/02074 , H01L21/6704 , H01L21/67051
摘要： An apparatus for processing a substrate, comprising: a process chamber having a track; a carrier connected to the track; upper and lower proximity heads in the chamber and positioned along the path, the proximity heads having opposing faces that define a gap in which a meniscus of fluid is formed, the path being defined along the gap between the opposing faces; a first pre-wet dispenser and a second pre-wet dispenser disposed along side of the upper proximity head and directed toward the path; a drive for moving each of the pre-wet dispensers between a center position along the length of the upper proximity head and opposite outer positions near outer ends of the upper proximity head; and a pre-wet controller for causing the drive to move each of the first and second pre-wet dispensers based on a position of the carrier when moved under the first and second pre-wet dispensers.
摘要翻译：一种用于处理衬底的设备，包括：具有轨道的处理室; 连接到轨道的载体; 所述腔室中的上和下邻近头部沿所述路径定位，所述邻近头部具有限定形成有液体弯液面的间隙的相对面，所述路径沿着相对面之间的间隙限定; 第一预湿式分配器和第二预湿式分配器，其设置在上接近头部的侧面并且朝向路径; 驱动器，用于在沿着上邻近头部的长度的中心位置和靠近上接近头部的外端的相对的外部位置之间移动每个预湿式分配器; 以及预湿式控制器，用于当所述第一和第二预湿式分配器下移动时，使得所述驱动器基于所述载体的位置移动所述第一和第二预湿式分配器中的每一个。

2. 发明申请

US20130081655A1 APPARATUS AND METHODS FOR PROCESSING A SUBSTRATE 有权
标题翻译：用于处理基板的装置和方法
公开(公告)号：US20130081655A1
公开(公告)日：2013-04-04
申请号：US13251064
申请日：2011-09-30
申请人： Arjun Mendiratta , Cheng-Yu Lin , David Mui
发明人： Arjun Mendiratta , Cheng-Yu Lin , David Mui
IPC分类号： B08B3/04 , B08B1/02
CPC分类号： B08B1/02 , B08B3/04 , H01L21/02065 , H01L21/02074 , H01L21/6704 , H01L21/67051
摘要： Apparatus and methods for processing a substrate are described. The methods include generating a fluid meniscus between upper and lower proximity heads. Each of the upper and lower proximity heads has a length that extends up to at least a diameter of the substrate. The method further includes dispensing a pre-wetting fluid towards an edge region of the substrate to form a pre-wet fluid meniscus on the edge region. The method also includes progressively moving the substrate along a path that is defined between the upper and lower proximity heads to progressively establish contact between the pre-wet fluid meniscus and the fluid meniscus.
摘要翻译：描述了用于处理衬底的装置和方法。所述方法包括在上和下邻近头之间产生流体弯液面。上部和下部接近头部中的每一个具有至少延伸到基底的直径的长度。该方法还包括向衬底的边缘区域分配预润湿流体，以在边缘区域上形成预湿液体弯液面。该方法还包括沿着限定在上部和下部邻近头部之间的路径逐渐移动衬底，以逐渐建立预湿液体弯月面和流体弯液面之间的接触。

3. 发明授权

US08480809B2 Methods for application of two-phase contaminant removal medium 有权
标题翻译：两相污染物去除介质的应用方法
公开(公告)号：US08480809B2
公开(公告)日：2013-07-09
申请号：US13351217
申请日：2012-01-16
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/00 , C11D11/00
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： A method is provided for receiving the wafer on a support, the support being configured for movement along a direction. While moving the wafer, dispensing a cleaning material to clean contaminants from the surface of the wafer, the dispensing applied as a film over a diameter length of the wafer. The cleaning material contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound. Each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, and wherein the polymers become soluble in the cleaning liquid and the solubilized polymers having long polymer chains that capture and entrap solid components and contaminants in the cleaning liquid. Then, rinsing the film off of the wafer with a rinsing meniscus. The rinsing meniscus applied along the diameter length of the wafer and the film is rinsed after the dispensing.
摘要翻译：提供了一种用于在支撑件上接收晶片的方法，所述支撑件被配置为沿着方向移动。在移动晶片时，分配清洁材料以清洁来自晶片表面的污染物，分配作为薄膜施加在晶片的直径长度上。清洁材料包含清洁液体，多种固体组分和聚合物的聚合物。多个固体组分和聚合物中的每一种都大于零且小于洗涤材料的3％，并且其中聚合物变得可溶于清洁液体，并且具有长的聚合物链的溶解聚合物捕获并捕获固体组分和污染物清洗液。然后，用冲洗弯液面从晶片上冲洗薄膜。沿着晶片的直径长度施加的冲洗弯月面，并且在分配之后冲洗薄膜。

4. 发明申请

US20100120647A1 COMPOSITION OF A CLEANING MATERIAL FOR PARTICLE REMOVAL 有权
标题翻译：用于颗粒去除的清洁材料的组成
公开(公告)号：US20100120647A1
公开(公告)日：2010-05-13
申请号：US12267345
申请日：2008-11-07
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： C11D3/37
CPC分类号： C11D7/5004 , C11D3/222 , C11D3/3765 , C11D3/3773 , C11D3/3776
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. To assist removing of particles from the wafer (or substrate) surfaces, the polymeric compound of the polymers can contain a polar functional group, which can establish polar-polar molecular interaction and hydrogen bonds with hydrolyzed particles on the wafer surface. The polymers of a polymeric compound(s) with a large molecular weight form long polymer chains and network. The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials. The polymeric compound(s) of the polymers may also include a functional group that carries charge in the cleaning solution. The charge of the functional group of the polymers improves the particle removal efficiency.
摘要翻译：本发明的实施例提供用于清洁具有精细特征的图案化衬底的改进材料。清洁材料在清洁具有精细特征的图案化基材上具有优点，而基本上不损坏特征。清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损坏降低在一起。为了帮助从晶片（或衬底）表面去除颗粒，聚合物的聚合物可以含有极性官能团，其可以与晶片表面上的水解颗粒建立极性极性的分子相互作用和氢键。具有大分子量的高分子化合物的聚合物形成长的聚合物链和网络。与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。聚合物的聚合物还可以包括在清洁溶液中携带电荷的官能团。聚合物官能团的电荷提高了颗粒去除效率。

5. 发明申请

US20120132235A1 Apparatus for Application of Two-Phase Contaminant Removal Medium 有权
标题翻译：两相污染物去除介质的应用设备
公开(公告)号：US20120132235A1
公开(公告)日：2012-05-31
申请号：US13351114
申请日：2012-01-16
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/08 , B08B5/04 , B08B3/02
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： An apparatus is provided that includes a substrate support assembly for holding the semiconductor substrate and a dispense head for applying a cleaning material to clean the contaminants from the substrate surface. The dispense head extends across a length of the semiconductor substrate and is positioned proximate to the substrate surface at a distance of between about 0.1 mm and about 4.5 mm. The proximate position enables application of a force to the cleaning material as it is applied to the substrate surface as a film, and the cleaning material provided through the dispense head contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound, each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, the plurality of solid components and the polymers are dispersed for application through the dispense head.
摘要翻译：提供了一种装置，其包括用于保持半导体基板的基板支撑组件和用于施加清洁材料以从基板表面清洁污染物的分配头。分配头延伸穿过半导体衬底的长度，并且以约0.1mm至约4.5mm的距离定位在衬底表面附近。靠近的位置使得当作为薄膜施加到基材表面时能够对清洁材料施加力，并且通过分配头提供的清洁材料含有清洁液体，多种固体组分和聚合物的聚合物多个固体组分和聚合物中的每一个都大于零且小于清洁材料的3％，多个固体组分和聚合物通过分散头分散以供施用。

6. 发明申请

US20120132229A1 Methods for Application of Two-Phase Contaminant Removal Medium 有权
标题翻译：两相污染物去除介质的应用方法
公开(公告)号：US20120132229A1
公开(公告)日：2012-05-31
申请号：US13351217
申请日：2012-01-16
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/08
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： A method is provided for receiving the wafer on a support, the support being configured for movement along a direction. While moving the wafer, dispensing a cleaning material to clean contaminants from the surface of the wafer, the dispensing applied as a film over a diameter length of the wafer. The cleaning material contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound. Each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, and wherein the polymers become soluble in the cleaning liquid and the solubilized polymers having long polymer chains that capture and entrap solid components and contaminants in the cleaning liquid. Then, rinsing the film off of the wafer with a rinsing meniscus. The rinsing meniscus applied along the diameter length of the wafer and the film is rinsed after the dispensing.
摘要翻译：提供了一种用于在支撑件上接收晶片的方法，所述支撑件被配置为沿着方向移动。在移动晶片时，分配清洁材料以清洁来自晶片表面的污染物，分配作为薄膜施加在晶片的直径长度上。清洁材料包含清洁液体，多种固体组分和聚合物的聚合物。多个固体组分和聚合物中的每一种都大于零且小于洗涤材料的3％，并且其中聚合物变得可溶于清洁液体，并且具有长的聚合物链的溶解聚合物捕获并捕获固体组分和污染物清洗液。然后，用冲洗弯液面从晶片上冲洗薄膜。沿着晶片的直径长度施加的冲洗弯月面，并且在分配之后冲洗薄膜。

7. 发明授权

US08601639B2 Apparatus for application of two-phase contaminant removal medium 有权
标题翻译：用于应用两相污染物去除介质的设备
公开(公告)号：US08601639B2
公开(公告)日：2013-12-10
申请号：US13351114
申请日：2012-01-16
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/02
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： An apparatus is provided that includes a substrate support assembly for holding the semiconductor substrate and a dispense head for applying a cleaning material to clean the contaminants from the substrate surface. The dispense head extends across a length of the semiconductor substrate and is positioned proximate to the substrate surface at a distance of between about 0.1 mm and about 4.5 mm. The proximate position enables application of a force to the cleaning material as it is applied to the substrate surface as a film, and the cleaning material provided through the dispense head contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound, each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, the plurality of solid components and the polymers are dispersed for application through the dispense head.
摘要翻译：提供了一种装置，其包括用于保持半导体基板的基板支撑组件和用于施加清洁材料以从基板表面清洁污染物的分配头。分配头延伸穿过半导体衬底的长度，并且以约0.1mm至约4.5mm的距离定位在衬底表面附近。靠近的位置使得当作为薄膜施加到基材表面时能够对清洁材料施加力，并且通过分配头提供的清洁材料含有清洁液体，多种固体组分和聚合物的聚合物多个固体组分和聚合物中的每一个都大于零且小于清洁材料的3％，多个固体组分和聚合物通过分散头分散以供施用。

8. 发明授权

US08227394B2 Composition of a cleaning material for particle removal 有权
标题翻译：用于除尘的清洁材料的组成
公开(公告)号：US08227394B2
公开(公告)日：2012-07-24
申请号：US12267345
申请日：2008-11-07
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： C11D3/26 , C11D3/37 , C11D3/43
CPC分类号： C11D7/5004 , C11D3/222 , C11D3/3765 , C11D3/3773 , C11D3/3776
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. To assist removing of particles from the wafer (or substrate) surfaces, the polymeric compound of the polymers can contain a polar functional group, which can establish polar-polar molecular interaction and hydrogen bonds with hydrolyzed particles on the wafer surface. The polymers of a polymeric compound(s) with a large molecular weight form long polymer chains and network. The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials. The polymeric compound(s) of the polymers may also include a functional group that carries charge in the cleaning solution. The charge of the functional group of the polymers improves the particle removal efficiency.
摘要翻译：本发明的实施例提供用于清洁具有精细特征的图案化衬底的改进材料。清洁材料在清洁具有精细特征的图案化基材上具有优点，而基本上不损坏特征。清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损坏降低在一起。为了帮助从晶片（或衬底）表面去除颗粒，聚合物的聚合物可以含有极性官能团，其可以与晶片表面上的水解颗粒建立极性极性的分子相互作用和氢键。具有大分子量的高分子化合物的聚合物形成长的聚合物链和网络。与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。聚合物的聚合物还可以包括在清洁溶液中携带电荷的官能团。聚合物官能团的电荷提高了颗粒去除效率。

9. 发明授权

US07967019B2 Method and apparatus for removing contaminants from substrate 有权
标题翻译：从基材去除污染物的方法和设备
公开(公告)号：US07967019B2
公开(公告)日：2011-06-28
申请号：US12212579
申请日：2008-09-17
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/00
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
摘要翻译：将清洁材料施加到基板的表面。清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合物材料。冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

10. 发明授权

US08758522B2 Method and apparatus for removing contaminants from substrate 有权
标题翻译：从基材去除污染物的方法和设备
公开(公告)号：US08758522B2
公开(公告)日：2014-06-24
申请号：US13115649
申请日：2011-05-25
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/02
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
摘要翻译：将清洁材料施加到基板的表面。清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合材料。冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

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