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    • 1. 发明授权
    • Thermal protection of traction inverters
    • 牵引逆变器热保护
    • US5712802A
    • 1998-01-27
    • US633390
    • 1996-04-16
    • Ajith Kuttannair KumarPeter Billey Macchiaroli
    • Ajith Kuttannair KumarPeter Billey Macchiaroli
    • G05D23/19H05K7/20H01L23/34
    • H05K7/20918G05D23/1917H05K7/20945H01L2924/0002
    • A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown includes the steps of computing the cooling air mass flow rate, creating an electronic model of the semiconductor/heat sink combination and estimating the semiconductor junction temperature from the mass flow rate and model. The cooling mass flow rate is determined by measuring the temperature of the cooling air prior to passage over the heat sink, measuring atmospheric pressure of the cooling air, determining the volumetric air flow rate of the cooling air and computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate. Power dissipation in the semiconductors is then computed and heat sink and semiconductor temperatures are estimated from power dissipation and cooling air mass flow rate. Semiconductor power dissipation is limited so as to restrict semiconductor temperature to a safe operating value.
    • 一种无需直接测量半导体温度的强制风冷功率电子半导体的热保护方法,安装在冷却空气吹过的散热片上的半导体包括计算冷却空气质量流量,形成电子模型的步骤 的半导体/散热器组合,并从质量流量和模型估计半导体结温度。 冷却质量流量通过在冷却空气通过之前测量冷却空气的温度来测定,测量冷却空气的大气压力,确定冷却空气的体积空气流速并从冷却空气温度计算, 压力和体积流量,冷却空气质量流量。 然后计算半导体中的功率消耗,并根据功率耗散和冷却空气质量流量来估计散热器和半导体温度。 半导体功耗受到限制,从而将半导体温度限制在安全的工作值。