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1. 发明授权

US08253489B2 Amplifier, transmitter, and method for compensating gain 有权
标题翻译：用于补偿增益的放大器，发射器和方法
公开(公告)号：US08253489B2
公开(公告)日：2012-08-28
申请号：US12756295
申请日：2010-04-08
申请人： Fumihiro Tomisawa , Tatsuhiko Tajima
发明人： Fumihiro Tomisawa , Tatsuhiko Tajima
IPC分类号： H03G3/20
CPC分类号： H03F1/304 , H03F1/301
摘要： An amplifier includes a voltage detector that detects current flowing to a drain terminal of a transistor which amplifies a signal using GaN as a voltage difference by means of voltage conversion, a compensation decision unit that decides whether or not to perform gain compensation based on the voltage difference detected by the voltage detector, and a gain compensation unit that performs the gain compensation according to the voltage difference when the compensation decision unit decides to perform the gain compensation.
摘要翻译：放大器包括：电压检测器，其检测流过晶体管的电流的电流，该晶体管通过电压转换将使用GaN放大的信号放大为电压差;补偿判定单元，其基于电压判定是否进行增益补偿由电压检测器检测的差值;以及增益补偿单元，其在补偿判定单元决定执行增益补偿时根据电压差执行增益补偿。

2. 发明申请

US20100289585A1 AMPLIFIER, TRANSMITTER, AND METHOD FOR COMPENSATING GAIN 有权
标题翻译：放大器，发射器和补偿增益的方法
公开(公告)号：US20100289585A1
公开(公告)日：2010-11-18
申请号：US12756295
申请日：2010-04-08
申请人： Fumihiro Tomisawa , Tatsuhiko Tajima
发明人： Fumihiro Tomisawa , Tatsuhiko Tajima
IPC分类号： H03G3/20
CPC分类号： H03F1/304 , H03F1/301
摘要： An amplifier includes a voltage detector that detects current flowing to a drain terminal of a transistor which amplifies a signal using GaN as a voltage difference by means of voltage conversion, a compensation decision unit that decides whether or not to perform gain compensation based on the voltage difference detected by the voltage detector, and a gain compensation unit that performs the gain compensation according to the voltage difference when the compensation decision unit decides to perform the gain compensation.
摘要翻译：放大器包括：电压检测器，其检测流过晶体管的电流的电流，该晶体管通过电压转换将使用GaN放大的信号放大为电压差;补偿判定单元，其基于电压判定是否进行增益补偿由电压检测器检测的差值;以及增益补偿单元，其在补偿判定单元决定执行增益补偿时根据电压差执行增益补偿。

3. 发明申请

US20070217173A1 Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：US20070217173A1
公开(公告)日：2007-09-20
申请号：US11447866
申请日：2006-06-07
申请人： Daisuke Mizutani , Tatsuhiko Tajima
发明人： Daisuke Mizutani , Tatsuhiko Tajima
IPC分类号： H05K7/00
CPC分类号： H05K9/0016 , H05K1/116 , H05K1/162 , H05K3/429 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2201/09318 , H05K2201/09327 , H05K2201/09672
摘要： The circuit board comprises a through-hole via which is formed in a through-hole passed through a substrate and includes a via portion electrically connected to a part of a plurality of interconnection layers at the inside wall of the through-hole and a pad portion formed on a surface of the substrate in a region surrounding the through-hole and is connected to the via portion. In the circuit board, an opening is formed for passing through the through-hole via out of connection with a constant-voltage interconnection layer in the region where the through-holes is formed. The constant-voltage interconnection layer is the interconnection layer nearest to the pad portion, and an outer diameter of the pad portion is larger than a diameter of the opening formed in the constant-voltage interconnection layer, whereby a capacitor including the pad portion and the constant-voltage interconnection layer as a pair of electrodes is formed.
摘要翻译：电路板包括通孔，该通孔形成在通过基板的通孔中，并且包括通孔部分，电连接到通孔内壁上的多个互连层的一部分，以及焊盘部分在围绕通孔的区域中形成在基板的表面上并连接到通孔部分。在电路板中，形成有用于在形成通孔的区域中通过与恒压互连层连接的通孔的开口。恒压互连层是最靠近焊盘部分的互连层，并且焊盘部分的外径大于形成在恒压互连层中的开口的直径，由此，包括焊盘部分和形成作为一对电极的恒压互连层。

4. 发明申请

US20080022518A1 Circuit board and method for manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20080022518A1
公开(公告)日：2008-01-31
申请号：US11591559
申请日：2006-11-02
申请人： Daisuke Mizutani , Tatsuhiko Tajima
发明人： Daisuke Mizutani , Tatsuhiko Tajima
IPC分类号： H05K3/36 , B05D1/02 , H05K1/00
CPC分类号： H05K1/024 , H05K1/0298 , H05K2201/0187 , H05K2201/0195 , H05K2201/0209 , Y10T29/49126
摘要： A circuit board for reducing a transmission loss and a method for manufacturing the circuit board. In the circuit board including a ground layer and power layer facing each other, a wiring layer disposed between the ground layer and the power layer, and an insulating section formed between the ground layer and the power layer so as to sandwich the wiring layer therebetween, a low dielectric loss layer having a dielectric tangent lower than that of the insulating section is formed at least on an upper or lower surface of the wiring layer. According to such a circuit board, the low dielectric loss layer is formed on an interface between the insulating section and the wiring layer, and therefore, a transmission loss in a high frequency region is reduced.
摘要翻译：一种用于降低传输损耗的电路板和一种用于制造电路板的方法。在包括接地层和功率层相对的电路板中，布置在接地层和功率层之间的布线层以及形成在接地层和功率层之间以将布线层夹在其间的绝缘部分，至少在布线层的上表面或下表面上形成具有低于绝缘部分的介电切线的低介电损耗层。根据这种电路板，低介电损耗层形成在绝缘部分和布线层之间的界面上，因此降低了高频区域的传输损耗。

5. 发明授权

US07851707B2 Circuit board and method for manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US07851707B2
公开(公告)日：2010-12-14
申请号：US11591559
申请日：2006-11-02
申请人： Daisuke Mizutani , Tatsuhiko Tajima
发明人： Daisuke Mizutani , Tatsuhiko Tajima
IPC分类号： H05K1/03
CPC分类号： H05K1/024 , H05K1/0298 , H05K2201/0187 , H05K2201/0195 , H05K2201/0209 , Y10T29/49126
摘要： A circuit board for reducing a transmission loss and a method for manufacturing the circuit board. In the circuit board including a ground layer and power layer facing each other, a wiring layer disposed between the ground layer and the power layer, and an insulating section formed between the ground layer and the power layer so as to sandwich the wiring layer therebetween, a low dielectric loss layer having a dielectric tangent lower than that of the insulating section is formed at least on an upper or lower surface of the wiring layer. According to such a circuit board, the low dielectric loss layer is formed on an interface between the insulating section and the wiring layer, and therefore, a transmission loss in a high frequency region is reduced.
摘要翻译：一种用于降低传输损耗的电路板和一种用于制造电路板的方法。在包括接地层和功率层相对的电路板中，布置在接地层和功率层之间的布线层以及形成在接地层和功率层之间以将布线层夹在其间的绝缘部分，至少在布线层的上表面或下表面上形成具有低于绝缘部分的介电切线的低介电损耗层。根据这种电路板，低介电损耗层形成在绝缘部分和布线层之间的界面上，因此降低了高频区域的传输损耗。

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