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    • 4. 发明申请
    • METHODS AND SYSTEMS FOR CHARACTERIZING SEMICONDUCTOR MATERIALS
    • 用于表征半导体材料的方法和系统
    • WO2007009078A1
    • 2007-01-18
    • PCT/US2006/027439
    • 2006-07-12
    • SEMATECH, INC.PRICE, James, Martin
    • PRICE, James, Martin
    • G01B11/06
    • G01B11/0616
    • Methods for determining parameters of a semiconductor material, for example, non- classical substrates such as silicon-on-insulator (SOI) substrates, strained silicon-on-insulator (sSOI) substrates, silicon-germanium-on-insulator (GeOI) substrates, and strained silicon- germanium-on-insulator (sGeOI) substrates are described. The method provides steps for transforming data corresponding to the semiconductor material from real space to reciprocal space. The critical points are isolated in the reciprocal state and corresponding critical energies of the critical points are determined. The difference between the critical energies may be used to determine a thickness of a layer of the semiconductor material, in particular, a quantum confined layer.
    • 用于确定半导体材料的参数的方法,例如非绝缘衬底,例如绝缘体上硅(SOI)衬底,应变绝缘体上硅(sSOI)衬底,绝缘体上硅(GeOI)衬底 ,并描述了应变的绝缘体上硅(sGeOI)衬底。 该方法提供用于将对应于半导体材料的数据从实际空间转换为互惠空间的步骤。 关键点在互逆状态下被隔离,确定临界点的相应临界能量。 临界能量之间的差异可用于确定半导体材料的层的厚度,特别是量子限制层。