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1. 发明授权

US07947163B2 Photoresist-free metal deposition 有权
标题翻译：无光致抗蚀剂金属沉积
公开(公告)号：US07947163B2
公开(公告)日：2011-05-24
申请号：US11890541
申请日：2007-08-06
申请人： Steven T. Mayer , John Stephen Drewery , Eric G. Webb
发明人： Steven T. Mayer , John Stephen Drewery , Eric G. Webb
IPC分类号： C25F3/14
CPC分类号： C25D5/022 , C25F5/00 , H05K3/07 , H05K3/108 , H05K2203/0108 , H05K2203/0392 , H05K2203/0537 , H05K2203/0713
摘要： Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.
摘要翻译：进行选择性加速或选择性抑制金属沉积以形成电子器件的金属结构。将所需的促进剂或抑制剂的图案施加到基材上; 例如，通过用图案化的印模冲压基板或使用喷墨打印机喷涂溶液。在其它实施方案中，将全局加速剂或抑制剂层施加到基底上并以期望的图案选择性地修饰。此后，进行选择性金属沉积。

2. 发明授权

US07686935B2 Pad-assisted electropolishing 失效
标题翻译：垫辅助电解抛光
公开(公告)号：US07686935B2
公开(公告)日：2010-03-30
申请号：US11213190
申请日：2005-08-26
申请人： Steven T. Mayer , Julia Svirchevski , John Stephen Drewery
发明人： Steven T. Mayer , Julia Svirchevski , John Stephen Drewery
IPC分类号： B23H5/06
CPC分类号： C25F3/30 , H01L21/32115 , H01L21/32125 , H01L21/6715
摘要： Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing liquid between the anodic substrate and a cathodic electropolishing head. The location of electrical contacts between the substrate and power supply allow peripheral edge regions of the substrate to be mechanically buffed with the pad. Preferably, a substrate is further planararized using an isotropic material-removal technique. An apparatus includes an electropolishing head that is movable to a position proximate to a first portion of a substrate to form a thin gap, and a buffing pad that mechanically buffs a second portion of the substrate using minimal pressure.
摘要翻译：通过在衬底的第一部分处执行金属的阳极溶解并且用抛光垫同时机械抛光衬底的第二部分来进行衬底辅助电抛光。阳极溶解包括在阳极底物和阴极电解抛光头之间形成电解抛光液体的薄液体层。基板和电源之间的电触点的位置允许基板的外围边缘区域被该机械抛光。优选地，使用各向同性材料去除技术进一步平坦化基底。一种设备包括电抛光头，该电抛光头可移动到接近基底的第一部分的位置以形成薄间隙;以及抛光垫，其利用最小的压力机械地抛光所述基底的第二部分。

3. 发明申请

US20090277802A1 Pad-assisted electropolishing 失效
公开(公告)号：US20090277802A1
公开(公告)日：2009-11-12
申请号：US11213190
申请日：2005-08-26
申请人： Steven T. Mayer , Julia Svirchevski , John Stephen Drewery
发明人： Steven T. Mayer , Julia Svirchevski , John Stephen Drewery
IPC分类号： B23H5/08
CPC分类号： C25F3/30 , H01L21/32115 , H01L21/32125 , H01L21/6715
摘要： Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing liquid between the anodic substrate and a cathodic electropolishing head. The location of electrical contacts between the substrate and power supply allow peripheral edge regions of the substrate to be mechanically buffed with the pad. Preferably, a substrate is further planararized using an isotropic material-removal technique. An apparatus includes an electropolishing head that is movable to a position proximate to a first portion of a substrate to form a thin gap, and a buffing pad that mechanically buffs a second portion of the substrate using minimal pressure.

4. 发明授权

US07560016B1 Selectively accelerated plating of metal features 有权
标题翻译：选择性加速电镀金属功能
公开(公告)号：US07560016B1
公开(公告)日：2009-07-14
申请号：US12291277
申请日：2008-11-07
申请人： Steven T. Mayer , John Stephen Drewery
发明人： Steven T. Mayer , John Stephen Drewery
IPC分类号： C25D5/02
CPC分类号： H05K3/243 , H05K3/108 , H05K2201/0367 , H05K2201/09745 , H05K2203/0392 , H05K2203/122
摘要： To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region and a recessed region in said first non-plating region. Then, an accelerator film is applied globally on the workpiece. A portion of the accelerator film is selectively removed from the field region, and another portion of the accelerator film remains in the recessed acceleration region. Then, metal is deposited onto the workpiece, and the metal deposits at an accelerated rate in the acceleration region, resulting in a greater thickness of metal in the acceleration region compared to metal in the non-activated field region. Then, metal is completely removed from the field region, thereby forming the metal feature.
摘要翻译：为了制造金属特征，将不可镀层施加到工件表面，然后被图案化以形成第一镀层区域和第一非镀层区域。然后，金属沉积在工件上，以在所述第一镀覆区域中形成凸起区域，并在所述第一非镀覆区域中形成凹陷区域。然后，加工膜全部应用于工件上。加速膜的一部分从场区域选择性地去除，并且加速膜的另一部分残留在凹入加速区域中。然后，金属沉积在工件上，并且金属在加速区域中以加速的速率沉积，导致与非激活场区域中的金属相比，加速区域中的金属厚度更大。然后，从场区域中完全去除金属，从而形成金属特征。

5. 发明授权

US07449099B1 Selectively accelerated plating of metal features 失效
标题翻译：选择性加速电镀金属功能
公开(公告)号：US07449099B1
公开(公告)日：2008-11-11
申请号：US10947085
申请日：2004-09-21
申请人： Steven T. Mayer , John Stephen Drewery
发明人： Steven T. Mayer , John Stephen Drewery
IPC分类号： C25D5/02
CPC分类号： H05K3/243 , H05K3/108 , H05K2201/0367 , H05K2201/09745 , H05K2203/0392 , H05K2203/122
摘要： To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region and a recessed region in said first non-plating region. Then, an accelerator film is applied globally on the workpiece. A portion of the accelerator film is selectively removed from the field region, and another portion of the accelerator film remains in the recessed acceleration region. Then, metal is deposited onto the workpiece, and the metal deposits at an accelerated rate in the acceleration region, resulting in a greater thickness of metal in the acceleration region compared to metal in the non-activated field region. Then, metal is completely removed from the field region, thereby forming the metal feature.
摘要翻译：为了制造金属特征，将不可镀层施加到工件表面，然后被图案化以形成第一镀层区域和第一非镀层区域。然后，金属沉积在工件上，以在所述第一镀覆区域中形成凸起区域，并在所述第一非镀覆区域中形成凹陷区域。然后，加工膜全部应用于工件上。加速膜的一部分从场区域选择性地去除，并且加速膜的另一部分残留在凹入加速区域中。然后，金属沉积在工件上，并且金属在加速区域中以加速的速率沉积，导致与非激活场区域中的金属相比，加速区域中的金属厚度更大。然后，从场区域中完全去除金属，从而形成金属特征。

6. 发明授权

US07041596B1 Surface treatment using iodine plasma to improve metal deposition 有权
标题翻译：使用碘等离子体进行表面处理以改善金属沉积
公开(公告)号：US07041596B1
公开(公告)日：2006-05-09
申请号：US10821751
申请日：2004-04-08
申请人： Jeremie James Dalton , Sanjay Gopinath , Jason M. Blackburn , John Stephen Drewery
发明人： Jeremie James Dalton , Sanjay Gopinath , Jason M. Blackburn , John Stephen Drewery
IPC分类号： H01L21/4763
CPC分类号： H01L21/76802 , C23C16/0245 , C23C16/18 , H01L21/28556 , H01L21/28562 , H01L21/76826 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： An excited surfactant species is created by generating plasma discharge in a surfactant precursor gas. A surfactant species typically includes at least one of iodine, led, thin, gallium, and indium. A surface of an integrated circuit substrate is exposed to the excited surfactant species to form a plasma-treated surface. A ruthenium thin film is deposited on the plasma-treated surface using a CVD technique.
摘要翻译：通过在表面活性剂前体气体中产生等离子体放电产生激发的表面活性剂种类。表面活性剂物质通常包括碘，铅，薄，镓和铟中的至少一种。将集成电路基板的表面暴露于被激发的表面活性剂种类以形成等离子体处理的表面。使用CVD技术将钌薄膜沉积在等离子体处理的表面上。

7. 发明授权

US06743661B1 Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive posts 有权
标题翻译：使用由具有导电柱的柔性介电材料包围的插入件来制造集成电路封装的方法
公开(公告)号：US06743661B1
公开(公告)日：2004-06-01
申请号：US10246133
申请日：2002-09-17
申请人： John Stephen Drewery
发明人： John Stephen Drewery
IPC分类号： H01L2148
CPC分类号： H01L23/49833 , H01L21/4846 , H01L21/6835 , H01L23/145 , H01L23/147 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/45014 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01322 , H01L2924/04941 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , Y10T29/49146 , Y10T29/49171 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/00012
摘要： An apparatus and method for flexibly bonding an integrated circuit package to a printed circuit board are provided. The apparatus includes a semiconductor having first and second sides, where the first side defines an inner region and peripheral region. The inner region is surrounded by the peripheral region. An interposer having a substantially similar coefficient of thermal expansion to the semiconductor is included. A dielectric region surrounding the interposer is included. The dielectric region is configured to be partially elastic. A plurality of posts extends transversely through the dielectric region. The post have first and second ends where the first end is configured to be attached to the peripheral region of the semiconductor chip. The second ends of the posts are configured to be attached to an external assembly, wherein the posts are able to absorb stress due to a thermal expansion mismatch between the external assembly and the interposer.
摘要翻译：提供了一种用于将集成电路封装件柔性地结合到印刷电路板的装置和方法。该装置包括具有第一和第二侧面的半导体，其中第一侧限定内部区域和周边区域。内部区域被周边区域包围。包括具有与半导体相当的热膨胀系数的插入件。包括中介层周围的电介质区域。电介质区域被构造成部分弹性。多个柱横向延伸通过介电区域。该柱具有第一端和第二端，其中第一端被配置为附接到半导体芯片的外围区域。柱的第二端构造成附接到外部组件，其中柱能够吸收由于外部组件和插入件之间的热膨胀失配而引起的应力。

8. 发明申请

US20090280243A1 Photoresist-free metal deposition 有权
公开(公告)号：US20090280243A1
公开(公告)日：2009-11-12
申请号：US11827800
申请日：2007-07-13
申请人： Steven T. Mayer , John Stephen Drewery , Eric G. Webb
发明人： Steven T. Mayer , John Stephen Drewery , Eric G. Webb
IPC分类号： C09D7/00
CPC分类号： C25D5/022 , C25F5/00 , H05K3/07 , H05K3/108 , H05K2203/0108 , H05K2203/0392 , H05K2203/0537 , H05K2203/0713
摘要： Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

9. 发明申请

US20090266707A1 Pad-assisted electropolishing 审中-公开
标题翻译：垫辅助电解抛光
公开(公告)号：US20090266707A1
公开(公告)日：2009-10-29
申请号：US11890551
申请日：2007-08-06
申请人： Steven T. Mayer , Julia Svirchevski , John Stephen Drewery
发明人： Steven T. Mayer , Julia Svirchevski , John Stephen Drewery
IPC分类号： C25B9/00
CPC分类号： C25F3/30 , H01L21/32115 , H01L21/32125
摘要： Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing liquid between the anodic substrate and a cathodic electropolishing head. The location of electrical contacts between the substrate and power supply allow peripheral edge regions of the substrate to be mechanically buffed with the pad. Preferably, a substrate is further planararized using an isotropic material-removal technique. An apparatus includes an electropolishing head that is movable to a position proximate to a first portion of a substrate to form a thin gap, and a buffing pad that mechanically buffs a second portion of the substrate using minimal pressure.
摘要翻译：通过在衬底的第一部分处执行金属的阳极溶解并且用抛光垫同时机械抛光衬底的第二部分来进行衬底辅助电抛光。阳极溶解包括在阳极底物和阴极电解抛光头之间形成电解抛光液体的薄液体层。基板和电源之间的电触点的位置允许基板的外围边缘区域被该机械抛光。优选地，使用各向同性材料去除技术进一步平坦化基底。一种设备包括电抛光头，该电抛光头可移动到接近基底的第一部分的位置以形成薄间隙;以及抛光垫，其利用最小的压力机械地抛光所述基底的第二部分。

10. 发明授权

US06525407B1 Integrated circuit package 失效
标题翻译：集成电路封装
公开(公告)号：US06525407B1
公开(公告)日：2003-02-25
申请号：US09895523
申请日：2001-06-29
申请人： John Stephen Drewery
发明人： John Stephen Drewery
IPC分类号： H01L23495
CPC分类号： H01L23/49833 , H01L21/4846 , H01L21/6835 , H01L23/145 , H01L23/147 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/45014 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01322 , H01L2924/04941 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , Y10T29/49146 , Y10T29/49171 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/00012
摘要： An apparatus and method for flexibly bonding an integrated circuit package to a printed circuit board are provided. The apparatus includes a semiconductor having first and second sides, where the first side defines an inner region and peripheral region. The inner region is surrounded by the peripheral region. An interposer having a substantially similar coefficient of thermal expansion to the semiconductor is included. A dielectric region surrounding the interposer is included. The dielectric region is configured to be partially elastic. A plurality of posts extends transversely through the dielectric region. The post have first and second ends where the first end is configured to be attached to the peripheral region of the semiconductor chip. The second ends of the posts are configured to be attached to an external assembly, wherein the posts are able to absorb stress due to a thermal expansion mismatch between the external assembly and the interposer.
摘要翻译：提供了一种用于将集成电路封装件柔性地结合到印刷电路板的装置和方法。该装置包括具有第一和第二侧面的半导体，其中第一侧限定内部区域和周边区域。内部区域被周边区域包围。包括具有与半导体相当的热膨胀系数的插入件。包括中介层周围的电介质区域。电介质区域被构造成部分弹性。多个柱横向延伸通过介电区域。该柱具有第一端和第二端，其中第一端被配置为附接到半导体芯片的外围区域。柱的第二端构造成附接到外部组件，其中柱能够吸收由于外部组件和插入件之间的热膨胀失配而引起的应力。

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