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1. 发明授权

US06220771B1 Wafer backside protection apparatus 有权
标题翻译：晶片背面保护装置
公开(公告)号：US06220771B1
公开(公告)日：2001-04-24
申请号：US09461349
申请日：1999-12-15
申请人： Fu-Ching Tung , Hong-Ming Chen , Wu-Lang Lin , Chia-Ming Chen , Jen-Rong Huang , Peter L. Mahneke , Janathan Wang
发明人： Fu-Ching Tung , Hong-Ming Chen , Wu-Lang Lin , Chia-Ming Chen , Jen-Rong Huang , Peter L. Mahneke , Janathan Wang
IPC分类号： G03D500
CPC分类号： H01L21/6708 , G03F7/707 , G03F7/70916 , H01L21/67028
摘要： A wafer backside protection apparatus includes a motor, a vacuum chuck, an annular seat and a top cover. The motor has an output shaft upon which the chuck is mounted. The chuck has a front surface to suck and hold a wafer from its backside. The chuck has a backside in which a water guard ring and a plurality of slant bores are formed. The slant bores run from the water guard ring through the wafer front surface. The annular seat is located below the chuck and has two symmetrical slant nozzles projecting toward motor rotating direction for ejecting protection liquid to the water guard ring. Protection liquid may be spun and splashed out through the slant bores to form a protection liquid film between the chuck and the wafer backside due to centrifugal force resulting from chuck and wafer rotation driven by the motor. The protection liquid film may protect wafer backside from chemical erosion and contamination resulting from wafer production process.
摘要翻译：晶片背面保护装置包括电动机，真空吸盘，环形座和顶盖。马达具有输出轴，卡盘安装在该输出轴上。卡盘具有从其背面吸取并保持晶片的前表面。卡盘具有背面，其中形成有防水环和多个倾斜孔。倾斜的孔从防水环穿过晶片正面。环形座位于卡盘下方，并具有朝向马达旋转方向突出的两个对称倾斜喷嘴，用于将防护液喷射到防水环上。保护液体可以通过倾斜孔旋转溅出，由卡盘和由马达驱动的晶片旋转产生的离心力在卡盘和晶片背面之间形成保护液膜。保护液膜可以保护晶片背面免受晶片生产过程中的化学侵蚀和污染。

2. 发明授权

US06712926B2 Recycling apparatus 有权
标题翻译：回收设备
公开(公告)号：US06712926B2
公开(公告)日：2004-03-30
申请号：US10055993
申请日：2002-01-28
申请人： Yuan-Yuan Chiang , Fu-Ching Tung , Janathan Wang , Peter L. Mahneke
发明人： Yuan-Yuan Chiang , Fu-Ching Tung , Janathan Wang , Peter L. Mahneke
IPC分类号： B05C1108
CPC分类号： H01L21/67017
摘要： The present invention describes a chemical solution recycling apparatus in a spin etching and cleaning process chamber for manufacturing semiconductor devices. Modification of the exterior dimension and the main structure of the process chamber is not necessary. The recycling apparatus in accordance with the present invention may separate different chemical solutions into different vessels and recycle them thereafter. The recycling apparatus comprises a recycling ring moving up and down to collect the solution and a recycling circular tray for sorting the chemical solutions in different trenches and drains. Therefore, the chemical solutions may be collected by assigned vessels or may be recycled into the process chamber after necessary quality inspections.
摘要翻译：本发明描述了用于制造半导体器件的旋转蚀刻和清洁处理室中的化学溶液回收设备。改进外部尺寸和处理室的主要结构是不必要的。根据本发明的回收设备可以将不同的化学溶液分离成不同的容器，然后再循环使用。回收设备包括上下移动以收集溶液的回收环和用于将不同沟槽和排水沟中的化学溶液分类的回收圆形托盘。因此，化学溶液可以由指定的容器收集，或者可以在进行必要的质量检查后再循环到处理室中。

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