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1. 发明授权

US08597529B2 Method for processing substrate and method for producing liquid ejection head and substrate for liquid ejection head 有权
标题翻译：用于处理基板的方法和用于制造液体喷射头的液体喷射头和基板的方法
公开(公告)号：US08597529B2
公开(公告)日：2013-12-03
申请号：US12484937
申请日：2009-06-15
申请人： Keisuke Kishimoto , Satoshi Ibe , Takuya Hatsui , Shimpei Otaka , Hiroto Komiyama , Hiroyuki Morimoto , Masahiko Kubota , Toshiyasu Sakai
发明人： Keisuke Kishimoto , Satoshi Ibe , Takuya Hatsui , Shimpei Otaka , Hiroto Komiyama , Hiroyuki Morimoto , Masahiko Kubota , Toshiyasu Sakai
IPC分类号： G01D15/00
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1634 , B41J2/1635 , B41J2/1639
摘要： A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.
摘要翻译：一种处理衬底的方法包括制备在其第一表面侧上具有第一层的衬底，所述第一层具有能够抑制激光透射的材料，用来自与第一层相反的第二表面的激光来处理衬底基板的表面朝向基板的第一表面，并且允许激光到达第一层以在基板中形成孔，并且通过该孔从第二表面进行基板的蚀刻。

2. 发明授权

US08438729B2 Method of producing liquid discharge head 有权
标题翻译：液体排放头的制造方法
公开(公告)号：US08438729B2
公开(公告)日：2013-05-14
申请号：US11674710
申请日：2007-02-14
申请人： Satoshi Ibe , Shuji Koyama , Yoshiaki Suzuki , Hiroto Komiyama
发明人： Satoshi Ibe , Shuji Koyama , Yoshiaki Suzuki , Hiroto Komiyama
IPC分类号： B21D53/76 , B23P17/00
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1643 , Y10T29/49401
摘要： A method can produce a liquid discharge head including a liquid discharge energy generating element, a liquid discharge port, a liquid flow path, an electric circuit for driving the liquid discharge energy generating element, a first electrode pad for exchanging electrical signals with the exterior and a second electrode pad for testing the electric circuit. The method includes preparing a substrate provided with a conductive layer for forming the first electrode pad and the second electrode pad, forming a protective layer directly on the second electrode pad, after forming the protective layer, forming a metal layer by an electro less plating method on the conductive layer, removing the protective layer after the metal layer is formed, and providing a layer comprised of a resin on the second electrode pad after the protective layer is removed.
摘要翻译：一种方法可以产生包括液体排出能量产生元件，液体排出口，液体流动路径，用于驱动液体排出能量产生元件的电路的液体排出头，用于与外部交换电信号的第一电极焊盘和用于测试电路的第二电极焊盘。该方法包括制备形成第一电极焊盘和第二电极焊盘的导电层的基板，在形成保护层之后，在第二电极焊盘上直接形成保护层，通过电镀法形成金属层在导电层上，在形成金属层之后去除保护层，并且在除去保护层之后，在第二电极焊盘上提供由树脂构成的层。

3. 发明授权

US08371680B2 Substrate having protection layers for liquid-ejection head, liquid ejection head, method for manufacturing substrate for liquid-ejection head, and method for manufacturing liquid ejection head 有权
标题翻译：具有用于液体喷射头的保护层的底物，液体喷射头，用于制造液体喷射头的基底的方法，以及用于制造液体喷射头的方法
公开(公告)号：US08371680B2
公开(公告)日：2013-02-12
申请号：US12968734
申请日：2010-12-15
申请人： Hiroto Komiyama , Yoshinori Tagawa , Satoshi Ibe , Mitsuru Chida , Kazuhiro Asai
发明人： Hiroto Komiyama , Yoshinori Tagawa , Satoshi Ibe , Mitsuru Chida , Kazuhiro Asai
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1643 , B41J2/1645 , B41J2/1646
摘要： When an insulating layer is provided in order to protect an energy generating element, there arises a possibility that the layer dissolves in a contacting liquid. Therefore, in order to eject liquid, a first protection layer containing metal is provided on the insulating layer facing a substrate for a liquid-ejection head and a second protection layer containing metal is provided on the surface of a liquid supply port to which a base containing silicon is exposed.
摘要翻译：当提供绝缘层以保护能量产生元件时，会出现该层溶解在接触液体中的可能性。因此，为了喷射液体，在与液体喷射头的基板相对的绝缘层上设置有含有金属的第一保护层，在液体供给口的表面上设有含有金属的第二保护层，含硅。

4. 发明授权

US08267503B2 Ink jet recording head and manufacturing method therefor 有权
标题翻译：喷墨记录头及其制造方法
公开(公告)号：US08267503B2
公开(公告)日：2012-09-18
申请号：US11872383
申请日：2007-10-15
申请人： Shuji Koyama , Yoshiaki Suzuki , Satoshi Ibe , Hiroto Komiyama
发明人： Shuji Koyama , Yoshiaki Suzuki , Satoshi Ibe , Hiroto Komiyama
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1635 , B41J2/1639 , B41J2/1643 , B41J2/1645 , Y10T29/49401
摘要： A manufacturing method forms an ink jet recording head including an energy generating element for generating energy for ejecting ink, wiring and electrode pad for supplying electric power to the energy generating element, and a flow path formation member in which an ink flow path is formed in fluid communication with an ink ejection outlet. The method includes steps of preparing a substrate on which the energy generating element, the wiring and the electrode pad have been formed; forming a protection layer covering edges of and around the generating element and the electrode pad; forming, with patterning, an adhesion layer for adhering the flow path formation member to a surface of the substrate through the protection layer, on a portion of the protection layer where the flow path formation member is formed and a portion surrounding the electrode pad; and forming through an electroless plating, a nickel layer covering the electrode pad and a gold layer covering the nickel layer to provide a bump.
摘要翻译：一种制造方法形成一种喷墨记录头，其包括用于产生用于喷射墨水的能量的能量产生元件，用于向能量产生元件供应电力的布线和电极垫;以及流路形成构件，其中形成墨流路与喷墨口流体连通。该方法包括制备其上形成有能量产生元件，布线和电极焊盘的基板的步骤; 形成覆盖所述发电元件和所述电极焊盘的周围的周围的保护层; 通过图案形成用于通过保护层将流路形成部件粘附到基板的表面上的粘合层，形成有流路形成部件的保护层的一部分和围绕电极焊盘的部分; 以及通过无电解电镀，覆盖电极焊盘的镍层和覆盖镍层的金层形成凸块。

5. 发明授权

US08256878B2 Substrate for ink ejection heads, ink ejection head, method of manufacturing substrate, and method of manufacturing ink ejection head 有权
标题翻译：喷墨头用基板，喷墨头，基板的制造方法以及喷墨头的制造方法
公开(公告)号：US08256878B2
公开(公告)日：2012-09-04
申请号：US12635974
申请日：2009-12-11
申请人： Satoshi Ibe , Yoshinori Tagawa , Kazuhiro Asai , Hiroto Komiyama , Toshiaki Kurosu , Masataka Nagai
发明人： Satoshi Ibe , Yoshinori Tagawa , Kazuhiro Asai , Hiroto Komiyama , Toshiaki Kurosu , Masataka Nagai
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2/1643 , B41J2/1645
摘要： A liquid ejection head according to the present invention includes a heat-generating resistor layer, a first electrode layer, an insulating layer extending over the heat-generating resistive layers and the first electrode layer, and a second electrode layer that has a first portion which extending through the insulating layer and which is electrically connected to the first electrode layer and also has a second portion which is not in contact with the insulating layer. The second portion has a space or a piece of resin disposed between the insulating layer and the second electrode layer.
摘要翻译：根据本发明的液体喷射头包括发热电阻层，第一电极层，在发热电阻层和第一电极层上延伸的绝缘层，以及第二电极层，其具有第一部分，延伸穿过绝缘层并且电连接到第一电极层，并且还具有不与绝缘层接触的第二部分。第二部分具有设置在绝缘层和第二电极层之间的空间或一部分树脂。

6. 发明授权

US08114305B2 Method of manufacturing substrate for liquid discharge head 有权
标题翻译：液体排出头用基板的制造方法
公开(公告)号：US08114305B2
公开(公告)日：2012-02-14
申请号：US12203651
申请日：2008-09-03
申请人： Hiroto Komiyama , Hirokazu Komuro , Satoshi Ibe , Takuya Hatsui , Keisuke Kishimoto , Kazuhiro Asai , Shimpei Otaka
发明人： Hiroto Komiyama , Hirokazu Komuro , Satoshi Ibe , Takuya Hatsui , Keisuke Kishimoto , Kazuhiro Asai , Shimpei Otaka
IPC分类号： G01D15/00 , G11B5/127
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2/1639
摘要： A method of manufacturing a silicon substrate for a liquid discharge head with a liquid supply opening formed therein includes: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.
摘要翻译：制造其中形成有液体供应开口的液体排出头用硅基板的方法包括：通过激光加工在基板的一个表面上形成一个处理部分; 通过在与所述一个处理部分的一部分重叠的位置处进行激光处理并且不与所述一个处理部分的另一部分重叠来扩展所述一个处理部分以形成凹部; 并且从一个表面蚀刻具有形成在其中的凹部的基板以形成液体供应开口。

7. 发明授权

US08091234B2 Manufacturing method for liquid discharge head substrate 有权
标题翻译：液体排出头基板的制造方法
公开(公告)号：US08091234B2
公开(公告)日：2012-01-10
申请号：US12203681
申请日：2008-09-03
申请人： Satoshi Ibe , Hirokazu Komuro , Takuya Hatsui , Kazuhiro Asai , Shimpei Otaka , Hiroto Komiyama , Keisuke Kishimoto
发明人： Satoshi Ibe , Hirokazu Komuro , Takuya Hatsui , Kazuhiro Asai , Shimpei Otaka , Hiroto Komiyama , Keisuke Kishimoto
IPC分类号： B21D53/76 , B23P17/00
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1645 , Y10T29/49401
摘要： A manufacturing method, for a liquid discharge head that includes a silicon substrate in which a supply port is formed for supplying a liquid, includes the steps of providing the silicon substrate, a mask layer provided with an opening that corresponds to the supply port being provided on one face of the silicon substrate; forming a groove in the silicon substrate along the shape of the opening in the mask layer; removing, via sandblasting, silicon of the silicon substrate inward of the groove in the silicon substrate; and performing, from the one face, anisotropic etching of the silicon substrate that has been sandblasted, and forming the supply port.
摘要翻译：一种液体排出头的制造方法，其特征在于，包括形成有用于供给液体的供给口的硅基板的液体排出头，其特征在于，具备：提供所述硅基板的工序;设置有与供给口对应的开口的掩模层在硅衬底的一个面上; 沿着掩模层中的开口的形状在硅衬底中形成凹槽; 通过喷砂将硅衬底中的硅从硅衬底中的凹槽向内移除; 并且从一面进行已经喷砂的硅基板的各向异性蚀刻，并形成供给口。

8. 发明申请

US20070211115A1 LIQUID DISCHARGE HEAD AND PRODUCING METHOD THEREFOR 有权
标题翻译：液体排出头及其生产方法
公开(公告)号：US20070211115A1
公开(公告)日：2007-09-13
申请号：US11674710
申请日：2007-02-14
申请人： Satoshi IBE , Shuji Koyama , Yoshiaki Suzuki , Hiroto Komiyama
发明人： Satoshi IBE , Shuji Koyama , Yoshiaki Suzuki , Hiroto Komiyama
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1643 , Y10T29/49401
摘要： For providing a producing method for a liquid discharge head having an excellent reliability in the insulation of test electrode pad, the invention provides a method for producing a liquid discharge head including a liquid discharge energy generating element for generating a liquid discharge energy, a liquid discharge port, a liquid flow path, an electric circuit for driving the liquid discharge energy generating element, a first electrode pad for exchanging electrical signals with the exterior and a second electrode pad for testing the electric circuit, the method including, preparing a substrate provided with a first wiring layer for forming the first electrode pad and a second wiring layer for forming the second electrode pad, forming an insulating film on the substrate so as to expose the first wiring layer and to cover the second wiring layer, forming a metal film by an electroless plating method on the surface of the first wiring layer, and stripping the insulating film.
摘要翻译：为了提供一种具有优异的测试电极焊盘绝缘可靠性的液体排出头的制造方法，本发明提供了一种用于生产液体排出头的方法，该排液头包括用于产生液体排出能量的液体排出能量产生元件，液体流路，用于驱动液体排出能量产生元件的电路，用于与外部交换电信号的第一电极焊盘和用于测试电路的第二电极焊盘，所述方法包括：制备具有用于形成第一电极焊盘的第一布线层和用于形成第二电极焊盘的第二布线层，在基板上形成绝缘膜，以暴露第一布线层并覆盖第二布线层，通过在第一布线层的表面上形成化学镀方法，剥离绝缘膜。

9. 发明授权

US08613862B2 Method for manufacturing liquid discharge head substrate 有权
标题翻译：液体排出头基板的制造方法
公开(公告)号：US08613862B2
公开(公告)日：2013-12-24
申请号：US12203612
申请日：2008-09-03
申请人： Kazuhiro Asai , Hirokazu Komuro , Satoshi Ibe , Takuya Hatsui , Shimpei Otaka , Hiroto Komiyama , Keisuke Kishimoto
发明人： Kazuhiro Asai , Hirokazu Komuro , Satoshi Ibe , Takuya Hatsui , Shimpei Otaka , Hiroto Komiyama , Keisuke Kishimoto
IPC分类号： G01D15/00 , G11B5/127
CPC分类号： B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645
摘要： A manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face.
摘要翻译：一种液体排出头基板的制造方法，其特征在于，具备形成有液体供给口的硅基板的液体排出头基板的制造方法，其特征在于，包括以下工序：制作所述硅基板，在其一面上形成有开口的掩模层，存放在所述硅衬底中形成第一凹部，使得所述凹部从所述硅衬底的一个面向所述开口延伸到所述硅衬底的另一面; 通过使用掩模层经由第一凹部对基板进行湿法蚀刻来形成第二凹部; 并且在从第二凹部到另一面的方向上对硅衬底进行干蚀刻。

10. 发明申请

US20110167636A1 MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD 有权
标题翻译：液体放电头的制造方法
公开(公告)号：US20110167636A1
公开(公告)日：2011-07-14
申请号：US12983505
申请日：2011-01-03
申请人： Keiji Edamatsu , Yoshinori Tagawa , Kazuhiro Asai , Satoshi Ibe , Hiroto Komiyama , Toshiaki Kurosu , Masataka Nagai
发明人： Keiji Edamatsu , Yoshinori Tagawa , Kazuhiro Asai , Satoshi Ibe , Hiroto Komiyama , Toshiaki Kurosu , Masataka Nagai
IPC分类号： B21D53/00
CPC分类号： B41J2/1603 , B41J2/162 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1645 , B41J2002/14475 , B41J2202/11 , Y10T29/42 , Y10T29/49401
摘要： There is disclosed a manufacturing method of a liquid discharge head including a substrate in which a first energy generating element and a second energy generating element that generate energy used for discharging liquid are provided, a discharge port member in which a first discharge port discharging the liquid is provided corresponding to the first energy generating element and a second discharge port discharging the liquid is provided corresponding to the second energy generating element, and a flow path wall member having a portion of the liquid flow path wall that communicates with the first discharge port and the second discharge port, in which a distance between the second energy generating element and the second discharge port is larger than that between the first energy generating element and the first discharge port.
摘要翻译：公开了一种液体排出头的制造方法，该液体排出头包括：基材，其中设置有产生用于排出液体的能量的第一能量产生元件和第二能量产生元件;排出口构件，其中排出液体的第一排出口对应于第一能量产生元件设置并且排出液体的第二排出口对应于第二能量产生元件设置;流路壁构件，其具有与第一排出口连通的液体流路壁的一部分，第二排出口，其中第二能量产生元件和第二排出口之间的距离大于第一能量产生元件和第一排出口之间的距离。

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