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    • 3. 发明授权
    • Semiconductor device with drift layer
    • 具有漂移层的半导体器件
    • US06476457B2
    • 2002-11-05
    • US09729081
    • 2000-12-05
    • Han Su Oh
    • Han Su Oh
    • H01L2358
    • H01L29/0847H01L29/42368H01L29/66659H01L29/7835
    • A semiconductor device includes a semiconductor substrate having a first conductive type impurity, a well having a second conductive type impurity formed in a predetermined region of the semiconductor substrate, a plurality of field oxide layer formed on an upper surface of the semiconductor substrate having the first conductive type impurity and the well having the second conductive type impurity, a gate electrode formed on corresponding portions of the field oxide layer and the well, and a lightly doped first impurity region formed in the well between the gate electrode and the first conductive type impurity region and surrounding the first conductive impurity region from sides and lower portions thereof and relatively lightly doped in comparison to the first conductive type impurity region. The device includes a junction of the lightly doped first impurity region surrounding the first conductive type impurity region is relatively deep in comparison to a junction of the lightly doped first impurity region below the field oxide layer, thereby sufficiently relieving electric field and preventing a hot carrier generation and heightening a junction breakdown voltage.
    • 半导体器件包括具有第一导电类型杂质的半导体衬底,形成在半导体衬底的预定区域中的具有第二导电类型杂质的阱,形成在半导体衬底的上表面上的多个场氧化物层, 导电型杂质和具有第二导电类型杂质的阱,形成在场氧化物层和阱的对应部分上的栅电极以及形成在阱电极和第一导电类型杂质之间的阱中的轻掺杂的第一杂质区 并且与第一导电类型杂质区相比,从其侧部和下部围绕第一导电杂质区并且相对轻掺杂。 该装置包括与第一导电类型杂质区域相邻的轻掺杂的第一杂质区域与场氧化物层下面的轻掺杂的第一杂质区域的结相比较深的结点,由此充分减轻电场并防止热载流子 产生并提高结击穿电压。
    • 4. 发明授权
    • High power semiconductor device and fabrication method thereof
    • 大功率半导体器件及其制造方法
    • US06448611B1
    • 2002-09-10
    • US09588546
    • 2000-06-06
    • Han-Su Oh
    • Han-Su Oh
    • H01L2976
    • H01L29/402H01L29/0847H01L29/42368H01L29/66659H01L29/7835
    • A high power semiconductor device and its fabrication method in which source and the drain regions are spaced apart from and edge of a field oxide layer. This allows the junction profile to become gently-sloped so that the junction breakdown voltage is increased. Also, since the edge of the field oxide layer is covered by the field plate and a ground voltage or below the ground voltage is applied to the field plate, the distribution of the strong electric field formed at the edge of the field oxide layer is dispersed, to further increase the junction breakdown voltage. Moreover, since the field plate covers the field oxide layer at the side of the drain of the high power semiconductor device, when a high voltage is applied to the drain, the electric field distribution is dispersed, so that the junction breakdown voltage at the edge of the gate electrode at the side of the drain can be increased.
    • 一种高功率半导体器件及其制造方法,其中源极和漏极区域与场氧化物层间隔开和边缘。 这允许结型材变得轻轻地倾斜,使得结击穿电压增加。 此外,由于场氧化物层的边缘被场板覆盖,并且接地电压或接地电压以下施加到场板,所以形成在场氧化物层的边缘处的强电场的分布被分散 ,进一步增加结击穿电压。 此外,由于场板覆盖大功率半导体器件的漏极侧的场氧化物层,当向漏极施加高电压时,电场分布被分散,使得边缘处的结击穿电压 可以增加漏极侧的栅电极。