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    • 5. 发明申请
    • CIRCUIT-BOARD DEVICE
    • 安排包括电路板
    • WO1995011580A1
    • 1995-04-27
    • PCT/DE1994001216
    • 1994-10-14
    • ROBERT BOSCH GMBHMAYER-STEUERNAGEL, WolfgangFASSEL, ReinhardKLINGER, HerbertSCHMIDT, Hans-Joerg
    • ROBERT BOSCH GMBH
    • H05K01/02
    • H05K1/0209H05K1/0206H05K1/0207H05K1/0298H05K3/429H05K2201/09572H05K2201/09618H05K2201/09663H05K2201/09781H05K2201/10166H05K2201/10689
    • The aim of the invention is to conduct away the heat produced by the operation of a power component (10) soldered on to a circuit board (13) via a soldering surface (12). To remove the heat, through-contacts (18) are provided which are situated outside the soldering surface (12) and are electrically insulated by a length of insulation (19). These through-contacts (18) ensure good thermal contact through the floor (23) of the circuit board (13) to the heat sink (35). The length of insulation (19) ensures that the contact surface of the power component (10), which is raised to an electrical potential, is separated electrically from the contact surface of the heat sink (35), which is normally earthed. The intermediate layers (21, 22) which will also be present in a multilayer circuit board (13) of conventional design and the use of through-contacts (18) filled with tin further enhance the conduction of heat from the power component (10) to the heat sink (35).
    • 一种动力装置(10),操作热的导出,被布置成通过一个焊接表面(12)上的电路板(13)的装置。 散热电通过绝缘间隙(19)和焊接表面的面积外部隔离(12)的通孔(18)。 这些电镀通孔(18)允许在所述印刷电路板(13)到所述散热器(35)的底部层(23)良好的热接触的。 隔离路径(19)提供功率器件(10)和所述散热器(35)的最领先的金属轴承表面的接地电位的电位著名轴承表面之间的电隔离。 另外,在传统类型的已知的中间层(21,22)的多层电路板(13)(多层)和可能除了与锡填充的通孔(18)促进从电源部件(10)到所述散热器(35)的热传递。