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    • 6. 发明授权
    • Methods for assembling an optical transceiver
    • 组装光收发器的方法
    • US07435014B2
    • 2008-10-14
    • US10924135
    • 2004-08-23
    • Paul K. RosenbergGary SasserChris TogamiDonald A. Ice
    • Paul K. RosenbergGary SasserChris TogamiDonald A. Ice
    • G02B6/36
    • G02B6/4292G02B6/42G02B6/4246
    • Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.
    • 装配光收发器的方法。 在一个示例中,该方法与包括发射机光学子组件和接收机光学子组件的光收发器相关联地执行,以及限定一对端口的结构,发射机光学子组件和接收机光学子组件分别与哪个端口 要对齐 该方法的该示例涉及将发射器光学子组件和接收器光学子组件相对于彼此定位在期望位置。 然后将发射机光学子组件和接收器光学子组件固定在期望的位置。 接下来,发射机光学子组件与其中一个端口对准,并且接收机光学子组件与另一个端口对准。 发射器光学子组件和接收器光学子组件与它们各自的端口的对准在一个操作中执行。
    • 7. 发明授权
    • Electromagnetic interference containment in a transceiver module
    • 收发模块中的电磁干扰抑制
    • US07422481B2
    • 2008-09-09
    • US11689379
    • 2007-03-21
    • Chris TogamiGary D. SasserAndy Engel
    • Chris TogamiGary D. SasserAndy Engel
    • G02B6/42
    • H04B15/00H01F2017/0093H01F2019/085H01R13/6582H01R13/6594
    • A transceiver module that utilizes an electromagnetic interference (EMI) containment structure for dealing with electromagnetic interference generated within the transceiver module. In one example embodiment, a transceiver module includes a housing, a printed circuit board disposed within the housing, and an EMI shield disposed about the printed circuit board. In this example embodiment, the printed circuit board includes electronic circuitry and a plurality of differential signal lines. Further, the EMI shield includes a body having a slot, a plurality of fingers on at least one edge of the body, and tabs that are operative to connect the body to the printed circuit board. The slot of the EMI shield receives the printed circuit board such that the differential signal lines of the printed circuit board pass through the slot. The fingers of the EMI shield enable the body to maintain a biased contact with the housing.
    • 收发器模块,其利用电磁干扰(EMI)容纳结构来处理收发器模块内产生的电磁干扰。 在一个示例实施例中,收发器模块包括壳体,布置在壳体内的印刷电路板和围绕印刷电路板设置的EMI屏蔽。 在该示例性实施例中,印刷电路板包括电子电路和多条差分信号线。 此外,EMI屏蔽包括具有槽的主体,在主体的至少一个边缘上的多个指状物,以及可操作以将主体连接到印刷电路板的突出部。 EMI屏蔽的槽口接收印刷电路板,使得印刷电路板的差分信号线通过槽。 EMI屏蔽的指状物使得主体能够保持与壳体的偏置接触。
    • 9. 发明申请
    • GROUNDING A PRINTED CIRCUIT BOARD IN A TRANSCEIVER MODULE
    • 在收发器模块中接地印刷电路板
    • US20070237489A1
    • 2007-10-11
    • US11689351
    • 2007-03-21
    • Gary D. SasserChris Togami
    • Gary D. SasserChris Togami
    • G02B6/00
    • G02B6/4246G02B6/4284H01R13/512H01R13/6485H01R13/6581H01R13/6583H01R13/6594H01R13/6658H01R13/7197H01R24/62
    • A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.
    • 一种收发机模块,其利用一种用于向位于所述收发器模块的连接器结构内的印刷电路板提供机架接地的设备。 在一个示例性实施例中,用于收发器模块中的接地夹具包括横臂,连接到横臂的一对臂,每对连接到该对臂之一的一对手指,以及至少一个突起 连接到横臂。 每个手指被配置成插入到连接器结构中的孔中并且被配置为电连接到印刷电路板的接地触头。 所述至少一个突起被构造成偏置与电连接到所述收发器模块的外壳的收发器模块的一部分偏压并且使其可靠地电接触。
    • 10. 发明申请
    • Dual stage modular optical devices
    • 双级模块化光学器件
    • US20050271391A1
    • 2005-12-08
    • US11134532
    • 2005-05-20
    • Chris TogamiGary Sasser
    • Chris TogamiGary Sasser
    • G02B6/38H04B10/00H04B10/24
    • H04B10/40G02B6/3897
    • Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
    • 本发明的实施例涉及用于发送和/或接收光信号的双级模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造的封装包括用于接受与光源和/或光检测器电互操作以传送光信号的电路的开口。 引线框架将第一制造的封装机械地连接到第二制造的封装并将光源和/或光检测器电连接到暴露在开口中的触点。 双级模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此,一个或多个光学连接被集成在主机设备或系统内。