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    • 7. 发明授权
    • CMOS image sensor and method of fabricating the same
    • CMOS图像传感器及其制造方法
    • US07838917B2
    • 2010-11-23
    • US12379111
    • 2009-02-12
    • Chang Hun Han
    • Chang Hun Han
    • H01L31/062H01L31/113
    • H01L27/14689H01L27/14603H01L27/1463
    • A CMOS image sensor and method for fabricating the same, wherein the CMOS image sensor has minimized dark current at the boundary area between a photodiode and an isolation layer. The present invention includes a first-conductivity-type doping area formed in the device isolation area of the substrate, the first-conductivity-type doping area surrounding the isolation area and a dielectric layer formed between the isolation layer and the first-conductivity-type doping area, wherein the first-conductivity-type doping area and the dielectric layer are located between the isolation layer and a second-conductivity-type diffusion area.
    • 一种CMOS图像传感器及其制造方法,其中CMOS图像传感器在光电二极管和隔离层之间的边界区域具有最小化的暗电流。 本发明包括在衬底的器件隔离区域中形成的第一导电型掺杂区域,围绕隔离区域的第一导电型掺杂区域和形成在隔离层和第一导电型之间的介电层 掺杂区域,其中所述第一导电型掺杂区域和所述介电层位于所述隔离层和第二导电型扩散区域之间。
    • 8. 发明授权
    • Method for manufacturing CMOS image sensor
    • CMOS图像传感器的制造方法
    • US07572663B2
    • 2009-08-11
    • US11615096
    • 2006-12-22
    • Chang Hun Han
    • Chang Hun Han
    • H01L31/18
    • H01L27/14689H01L27/14609H01L27/1462H01L27/14643
    • A method for manufacturing a CMOS image sensor is provided. The method can include forming an interlayer dielectric layer on a semiconductor substrate including a gate electrode, photodiode area, and LDD region; selectively removing the interlayer dielectric layer such that the interlayer dielectric layer remains on the photodiode area; performing a first heat treatment process; sequentially forming a first insulating layer and a second insulating layer on the semiconductor substrate, where the etching selectivity of the first insulating layer is different from the etching selectivity of the second insulating layer; selectively etching the second insulating layer to form spacers on sidewalls of the gate electrode; selectively removing the first insulating layer to expose a source/drain area and forming a high-density N-type diffusion area in the exposed source/drain area; performing a second heat treatment process; and forming a metal silicide layer the high-density N-type diffusion area.
    • 提供了一种用于制造CMOS图像传感器的方法。 该方法可以包括在包括栅电极,光电二极管区域和LDD区域的半导体衬底上形成层间电介质层; 选择性地去除所述层间电介质层,使得所述层间电介质层保留在所述光电二极管区域上; 执行第一热处理过程; 在所述半导体衬底上依次形成第一绝缘层和第二绝缘层,其中所述第一绝缘层的蚀刻选择性不同于所述第二绝缘层的蚀刻选择性; 选择性地蚀刻第二绝缘层以在栅电极的侧壁上形成间隔物; 选择性地去除第一绝缘层以暴露源极/漏极区域并在暴露的源极/漏极区域中形成高密度N型扩散区域; 执行第二热处理过程; 以及形成高密度N型扩散区域的金属硅化物层。
    • 9. 发明授权
    • CMOS image sensor and method for manufacturing the same
    • CMOS图像传感器及其制造方法
    • US07560674B2
    • 2009-07-14
    • US11486489
    • 2006-07-13
    • Chang Hun Han
    • Chang Hun Han
    • H01L27/00
    • H01L27/14645H01L27/14601H01L27/14632H01L27/14687H01L27/14689
    • Disclosed are a CMOS image sensor and a manufacturing method thereof. The present CMOS image sensor comprises: first, second, and third photo diodes and a plurality of transistors spaced at a predetermined distance in a semiconductor substrate; a diffusion blocking layer on substantially an entire surface of the substrate, including an opening therein exposing at least one of the photo diodes; an interlevel dielectric layer over the entire surface of the substrate, covering the diffusion blocking layer; first, second and third color filter layers over the interlevel dielectric layer, respectively corresponding to the first, second and third photo diodes, and a plurality of microlenses over the color filter layers, corresponding to each color filter layer.
    • 公开了CMOS图像传感器及其制造方法。 本CMOS图像传感器包括:第一,第二和第三光电二极管和在半导体衬底中以预定距离隔开的多个晶体管; 在基底的整个表面上的扩散阻挡层,包括其中暴露至少一个光电二极管的开口; 在衬底的整个表面上的层间电介质层,覆盖扩散阻挡层; 分别对应于第一,第二和第三光电二极管的层间电介质层上的第一,第二和第三滤色器层以及对应于每个滤色器层的滤色器层上的多个微透镜。