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1. 发明申请

WO2012112395A2 MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING MICRO-ELECTROMECHANICAL SYSTEM DEVICES 审中-公开
标题翻译：微机电系统装置及制造微电子系统装置的方法
公开(公告)号：WO2012112395A2
公开(公告)日：2012-08-23
申请号：PCT/US2012024672
申请日：2012-02-10
申请人： KIONIX INC , ADAMS SCOTT G , MINNICK ANDREW J , BLACKMER CHARLES W , BRENNAN KENNETH D , DEVOE MOLLIE K
发明人： ADAMS SCOTT G , MINNICK ANDREW J , BLACKMER CHARLES W , BRENNAN KENNETH D , DEVOE MOLLIE K
IPC分类号： B81C1/00
CPC分类号： B81B3/0008 , B81B2201/0235 , B81B2207/07 , G01P15/0802 , H01H59/0009 , H01L29/747 , H01L29/87
摘要： A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.
摘要翻译：微机电系统（MEMS）装置包括基板，第一光束，第二光束和第三光束。第一梁包括由隔离接头隔开的第一和第二部分。第一和第二部分各自包括半导体和第一介电层。导电迹线机械耦合到第一光束并且电耦合到第二部分的半导体，但不耦合到第一部分的半导体。第二光束包括第二介质层。通过干蚀刻形成第一，第二和第三光束中的每一个的轮廓。空腔将衬底的表面与第一，第二和第三光束分离。通过干蚀刻形成空腔。第一，第二和第三光束中的每一个的侧壁基本上没有布置在其上的电介质层，并且通过气相蚀刻去除了介电层。

2. 发明申请

WO2007061756A3 A TRI-AXIS ACCELEROMETER 审中-公开
公开(公告)号：WO2007061756A3
公开(公告)日：2007-05-31
申请号：PCT/US2006/044517
申请日：2006-11-16
申请人： KIONIX, INC. , ADAMS, Scott G. , MILLER, Scott A. , SHEN-EPSTEIN, June , EPSTEIN, Keith
发明人： ADAMS, Scott G. , MILLER, Scott A. , SHEN-EPSTEIN, June , EPSTEIN, Keith
IPC分类号： G01P15/00
摘要： In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.

3. 发明申请

WO2007061756A2 A TRI-AXIS ACCELEROMETER 审中-公开
标题翻译：三轴加速度计
公开(公告)号：WO2007061756A2
公开(公告)日：2007-05-31
申请号：PCT/US2006044517
申请日：2006-11-16
申请人： KIONIX INC , ADAMS SCOTT G , MILLER SCOTT A , SHEN-EPSTEIN JUNE , EPSTEIN KEITH
发明人： ADAMS SCOTT G , MILLER SCOTT A , SHEN-EPSTEIN JUNE , EPSTEIN KEITH
IPC分类号： G01P15/18 , G01P15/125 , H01L21/00
CPC分类号： G01P15/125 , G01P15/0802 , G01P15/18 , G01P2015/0828
摘要： In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.
摘要翻译：在本发明的一个实施例中，提供了一种微机电（MEMS）加速计，其包括衬底，第一传感器和第二传感器。第一传感器被配置为测量沿平行于衬底平面的第一轴的加速度。第二传感器配置为测量沿垂直于基板平面的轴的加速度。第二传感器包括第一梁，第二梁和单个支撑结构。单个支撑结构相对于衬底支撑第一和第二梁，其中第一和第二梁包围第一传感器。

4. 发明申请

WO2012112395A3 MICRO-ELECTROMECHANICAL SYSTEM DEVICES HAVING BEAMS AND METHODS OF MAKING SAME 审中-公开
公开(公告)号：WO2012112395A3
公开(公告)日：2012-08-23
申请号：PCT/US2012/024672
申请日：2012-02-10
申请人： KIONIX, INC. , ADAMS, Scott, G. , MINNICK, Andrew, J. , BLACKMER, Charles, W. , BRENNAN, Kenneth, D. , DEVOE, Mollie, K.
发明人： ADAMS, Scott, G. , MINNICK, Andrew, J. , BLACKMER, Charles, W. , BRENNAN, Kenneth, D. , DEVOE, Mollie, K.
IPC分类号： B81B3/00
摘要： A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.

5. 发明申请

WO2016033349A1 PRESSURE SENSOR INCLUDING DEFORMABLE PRESSURE VESSEL(S) 审中-公开
标题翻译：压力传感器，包括可变压力容器（S）
公开(公告)号：WO2016033349A1
公开(公告)日：2016-03-03
申请号：PCT/US2015/047238
申请日：2015-08-27
申请人： KIONIX, INC. , ADAMS, Scott, G. , BLACKMER, Charles, W. , LYNCH, Kristin, J.
发明人： ADAMS, Scott, G. , BLACKMER, Charles, W. , LYNCH, Kristin, J.
IPC分类号： G01L9/00
CPC分类号： G01L9/003 , B81B3/0072 , B81B2201/0264 , B81C1/00 , B81C1/00666 , B81C2201/0167 , G01L9/0027 , G01L9/0055 , G01L9/0073 , G01L9/008 , G01L9/0082 , G01L13/00 , G01L13/02 , G01P15/006 , G01P15/08 , H01L21/00
摘要： Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.
摘要翻译：本文描述了使用包括可变形压力容器的压力传感器进行压力感测的技术。压力容器是具有限定空隙的横截面的物体。可变形的压力容器是具有至少一个弯曲部分的压力容器，该弯曲部分构造成基于空腔中的腔体压力之间的压力差在结构上变形（例如弯曲，剪切，细长等），其中至少一个压力容器的一部分被悬浮并且在压力容器中存在容器压力。

6. 发明申请

WO2004059704A1 METHOD OF MANUFACTURING AN OXIDE BEAM 审中-公开
标题翻译：制造氧化物束的方法
公开(公告)号：WO2004059704A1
公开(公告)日：2004-07-15
申请号：PCT/US2002/041318
申请日：2002-12-26
申请人： KIONIX INC. , ADAMS, Scott, G. , MILLER, Scott, A.
发明人： MILLER, Scott, A.
IPC分类号： H01L21/00
CPC分类号： H01L21/76229 , B81B3/0086 , B81B2203/033 , B81C1/00126 , B81C2201/0178 , H01L21/31612 , H01L21/31662 , H01L21/76208
摘要： A method of manufacturing an insulating micro-structure (100) by etching a plurality of trenches in a silicon substrate (101) and filling said trenches with insulating materials (105, 107). The trenches are etched and then oxidized until completely or almost completely filled with silicon dioxide. Additional insulating material is then deposited as necessary to fill any remaining trenches, thus forming the structure. When the top of the structure is metallized, the insulating structure increases voltage resistance and reduces the capacitive coupling between the metal (109) and the silicon substrate. Part of the silicon substrate underlying the structure is optionally removed further to reduce the capacitive coupling effect. Hybrid silicon-insulator structures can be formed to gain the effect of the benefits of the structure in three-dimensional configurations, and to permit metallization of more than one side of the structure.
摘要翻译：一种通过蚀刻硅衬底（101）中的多个沟槽并用绝缘材料（105,107）填充所述沟槽来制造绝缘微结构（100）的方法。蚀刻沟槽，然后氧化直到完全或几乎完全充满二氧化硅。然后根据需要沉积额外的绝缘材料以填充任何剩余的沟槽，从而形成结构。当结构的顶部被金属化时，绝缘结构增加了电阻并降低了金属（109）和硅衬底之间的电容耦合。可选地，进一步去除结构底层的硅衬底的一部分以降低电容耦合效应。可以形成混合硅 - 绝缘体结构以获得三维结构中结构的益处的效果，并且允许结构多于一侧的金属化。

7. 发明申请

WO2012112452A3 STRENGTHENED MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING THEREOF 审中-公开
公开(公告)号：WO2012112452A3
公开(公告)日：2012-08-23
申请号：PCT/US2012/024886
申请日：2012-02-13
申请人： KIONIX, INC. , BLACKMER, Charles, W. , ADAMS, Scott, G. , HOCKING, Andrew, S. , LYNCH, Kristin, J. , SHAH, Ashish, A.
发明人： BLACKMER, Charles, W. , ADAMS, Scott, G. , HOCKING, Andrew, S. , LYNCH, Kristin, J. , SHAH, Ashish, A.
IPC分类号： B81C1/00 , H01L21/762
摘要： In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

8. 发明申请

WO2012112452A2 STRENGTHENED MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING THEREOF 审中-公开
标题翻译：加强型微机电系统装置及其制造方法
公开(公告)号：WO2012112452A2
公开(公告)日：2012-08-23
申请号：PCT/US2012024886
申请日：2012-02-13
申请人： KIONIX INC , BLACKMER CHARLES W , ADAMS SCOTT G , HOCKING ANDREW S , LYNCH KRISTIN J , SHAH ASHISH A
发明人： BLACKMER CHARLES W , ADAMS SCOTT G , HOCKING ANDREW S , LYNCH KRISTIN J , SHAH ASHISH A
IPC分类号： B81B3/00
CPC分类号： B81C1/00698 , B81B2203/0118 , B81B2203/033 , H01L21/76232
摘要： In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.
摘要翻译：在一个实施例中，微机电装置可以包括衬底，梁和隔离接头。梁可以相对于衬底的表面悬挂。隔离接头可以在梁的第一部分和第二部分之间，并且可以具有非线性形状。在另一个实施例中，微机电装置可以包括衬底，梁和隔离接头。梁可以相对于衬底的表面悬挂。隔离接头可以位于梁的第一部分和第二部分之间。隔离接头可以具有第一部分，第二部分以及第一部分和第二部分之间的桥接部分。隔离接头的第一和第二部分可以各自具有接缝和空隙，而桥接部分可以是实心的。

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