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1. 发明专利

JP3471775B2 Microphone holder 有权
公开(公告)号：JP3471775B2
公开(公告)日：2003-12-02
申请号：JP2001255985
申请日：2001-08-27
申请人：ヤマハメタニクス株式会社
发明人：訓享藤原 , 芳紀須藤
IPC分类号： H04R1/00 , H04R1/02 , H04R21/02
CPC分类号： H04R1/04 , H04R1/06

2. 发明专利

JP3942505B2 Titanium copper alloy material and a method of manufacturing the same 有权
公开(公告)号：JP3942505B2
公开(公告)日：2007-07-11
申请号：JP2002207528
申请日：2002-07-16
申请人：ヤマハメタニクス株式会社
发明人：孝水島
IPC分类号： B21B3/00 , C22C9/00 , C22F1/00 , C22F1/08

3. 发明专利

JP2005027345A Microphone holder 审中-公开
标题翻译：麦克风支架
公开(公告)号：JP2005027345A
公开(公告)日：2005-01-27
申请号：JP2004256593
申请日：2004-09-03
申请人： Yamaha Metanikusu Kk , ヤマハメタニクス株式会社
发明人： SUDO YOSHINORI , FUJIWARA KUNIYUKI
IPC分类号： H04R1/02
摘要： PROBLEM TO BE SOLVED: To provide a microphone holder for surely holding a microphone and easily performing its maintenance.
SOLUTION: A microphone holder 10 comprises a main body 13 comprising an opening 12 in which a microphone 11 can be inserted, on one end side, and a connecting terminal 15 which is supported by the main body 13 for conduction between the microphone 11 and a predetermined external member. The main body 13 comprises a peripheral wall 20 and a bottom wall 21 which is communicated to the peripheral wall 20 to constitute a sound release preventive part, and an undercut part 24 is provided on the upper end side of the peripheral wall 20. An inner end 29 of the connecting terminal 15 is ordinarily provided in an attitude away from the inner surface of the main body 13. The microphone 11 is inserted into the main body 13, so that the microphone 11 can be electrically conducted to the connecting terminal 15.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于可靠地保持麦克风并且容易执行其维护的麦克风保持器。麦克风保持器10包括主体13，主体13包括开口12，麦克风11可以在其一端侧插入，连接端子15由主体13支撑以在麦克风之间传导 11和预定的外部构件。主体13包括周壁20和底壁21，底壁21连接到周壁20以构成防音部，在周壁20的上端侧设置有底切部24。通常将连接端子15的端部29设置成远离主体13的内表面的姿态。麦克风11插入主体13中，使得麦克风11能够电连接到连接端子15。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004331993A Copper alloy 有权
公开(公告)号：JP2004331993A
公开(公告)日：2004-11-25
申请号：JP2003124746
申请日：2003-04-30
申请人： Kiyohito Ishida , Yamaha Metanikusu Kk , ヤマハメタニクス株式会社 , 清仁石田
发明人： ISHIDA KIYOHITO , KAINUMA RYOSUKE , KIMURA TAKASHI , MIURA MICHIO , MIZUSHIMA TAKASHI , TSUGANE YOZO
IPC分类号： C22C9/00 , C22C9/01 , C22C9/05 , C22C9/06 , C22C9/10
CPC分类号： C22C9/00 , C22C9/01 , C22C9/05 , C22C9/06 , C22C9/10
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy which has excellent thermal conductivity equal to that of conventionally used materials and also has thermal expansion coefficient lower than that of copper and can be manufactured at a low cost.
SOLUTION: A base material, such as oxygen-free copper and Cu-B alloy, is melted in vacuum by a high-frequency melting method. Then, B, Mg, Ni, Co, Al, Si, Fe, Zr and/or Mn is added, in the form of a simple substance or an alloy of Ni-B, Fe-B, Cu-Mg, etc., to the resultant molten metal so that prescribed contents are attained. The molten metal is cast into an ingot in the shape of a square 12 mm on a side, heated at 600 to 900°C for 1 h and then rolled to 3 mm by hot rolling. Subsequently, heat treatment is performed at 600 to 900°C and then working is applied into prescribed shape.
COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2004052008A Titanium-copper alloy and manufacturing method therefor 有权
公开(公告)号：JP2004052008A
公开(公告)日：2004-02-19
申请号：JP2002207528
申请日：2002-07-16
申请人： Yamaha Metanikusu Kk , ヤマハメタニクス株式会社
发明人： MIZUSHIMA TAKASHI
IPC分类号： B21B3/00 , C22C9/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a titanium-copper alloy with uniform and adequate mechanical properties such as bending properties and stress relaxation characteristics, and to provide a manufacturing method therefor.
SOLUTION: This method comprises primarily solution-treating a plate of a titanium-copper alloy comprising 1.0-5.0 wt.% Ti and the balance Cu by holding it at 820°C or higher for 100 seconds or longer, and primarily cold-rolling it at a reduction ratio of 50% or higher; then secondarily solution-treating the plate by heating it to 820°C or higher from room temperature at a temperature rising rate of 1,000°C/minute or more and holding it at 820°C or higher for 100 seconds or longer; secondarily cold-rolling the plate at a reduction ratio of 5-85%; and subsequently aging it by holding at 350-480°C for 2-10 hours.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2006241573A Plate of copper-titanium alloy and manufacturing method therefor 有权
标题翻译：铜合金板及其制造方法
公开(公告)号：JP2006241573A
公开(公告)日：2006-09-14
申请号：JP2005062444
申请日：2005-03-07
申请人： Yamaha Metanikusu Kk , ヤマハメタニクス株式会社
发明人： MIURA MICHIO , ISSHIKI MINORU , SUZUKI SHIGERU
IPC分类号： C22C9/00 , B21B3/00 , C22F1/00 , C22F1/08 , H01B1/02
摘要： PROBLEM TO BE SOLVED: To provide a plate of a copper-titanium alloy which can balance high intensity with high conductivity, and to provide a manufacturing method therefor.
SOLUTION: This manufacturing method comprises the steps of: holding a copper-titanium alloy material containing 3.2 mass% titanium in copper at 900°C for three minutes (solution treatment step S1); subsequently rolling it with a reduction rate of 10 to 50% (rolling step S2); then, ageing it at 500 to 600°C for 150 seconds to 30 minutes (ageing treatment step S3); subsequently rolling it with a reduction rate of 10 to 50% (rolling step S4); subsequently subjecting it to multistage ageing treatment (cooling ageing step S5), specifically, to the steps of holding it at 450°C for three hours, holding it at 400°C for three hours, holding it at 350°C for three hours, and holding it at 300°C for ten hours; and then, rolling it at a reduction rate of 10 to 50% (rolling step S6).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够平衡高强度和高导电性的铜 - 钛合金的板，并提供其制造方法。解决方案：该制造方法包括以下步骤：将含有3.2质量％的铜的铜 - 钛合金材料在900℃下保持3分钟（固溶处理步骤S1）; 然后以10〜50％的压下率进行轧制（轧制工序S2）。然后在500-600℃老化150秒至30分钟（时效处理步骤S3）; 然后以10〜50％的压下率进行轧制（轧制工序S4）。接着进行多级时效处理（冷却老化步骤S5），具体地说，涉及在450℃下保持3小时的步骤，在400℃下保持3小时，在350℃下保持3小时，并在300℃下保持10小时; 然后以10〜50％的压下率进行轧制（轧制工序S6）。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004091871A High strength copper alloy and its production method 有权
公开(公告)号：JP2004091871A
公开(公告)日：2004-03-25
申请号：JP2002255937
申请日：2002-08-30
申请人： Yamaha Metanikusu Kk , ヤマハメタニクス株式会社
发明人： SASAKI FUMIAKI , TSUGANE YOZO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08
CPC分类号： C22C9/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a high strength copper alloy which has high tensile strength and high proof stress, and has excellent bending workability as well, and to provide a production method therefor.
SOLUTION: A copper alloy stock having a composition comprising, by mass, 0.1 to 4% Ti, and the balance Cu with inevitable impurities is subjected to cold rolling, and is subjected to precipitation treatment and additional cold rolling as well. In the additional rolling stage, a working ratio is ≥3%, and the total working ratio in the rolling stage and the additional rolling stage is 15 to 50%. Further, heating is performed at 200 to 700°C for 0.5 to 15 hr or at 300 to 950°C for 10 to 1,000 s after the additional rolling stage, so that stress relieving annealing can be performed.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003061176A Microphone holder 有权
标题翻译：麦克风支架
公开(公告)号：JP2003061176A
公开(公告)日：2003-02-28
申请号：JP2001255985
申请日：2001-08-27
申请人： Yamaha Metanikusu Kk , ヤマハメタニクス株式会社
发明人： SUDO YOSHINORI , FUJIWARA KUNIYUKI
IPC分类号： H04R1/00 , H04R1/02 , H04R21/02
CPC分类号： H04R1/04 , H04R1/06
摘要： PROBLEM TO BE SOLVED: To provide a microphone holder with simplified assembling that can enhance the degree of freedom of the design of a communication device by relaxing limitation of positions for forming sound holes.
SOLUTION: A microphone holder 10 is configured to include a case 13 having a housing space 12 for housing a microphone member 11 in the inside. The case 13 is configured to include a circumferential wall 20 forming an opening 19 to contain the microphone member 11, a bottom wall 21 placed at a side opposite to the opening 19 and connected to the circumferential wall 20, and a terminal support 23 mountable to the opening 19 and integrated with electrode terminals 22, 22. The circumferential wall 20 and/or the bottom wall 21 are provided with a sound hole 28 leading to a sound collection part 15 of the microphone member 11 so as to shut the opening 19 and the sound hole 28 when the microphone member 11 is housed in a housing space 12.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供具有简化组装的麦克风支架，通过放宽形成声孔的位置限制，可以提高通信装置的设计自由度。解决方案：麦克风保持器10被配置为包括壳体13，壳体13具有用于将麦克风构件11容纳在内部的壳体空间12。壳体13构造成包括形成开口19的周壁20，以容纳麦克风构件11，设置在与开口19相对的一侧并连接到周壁20的底壁21和可安装到开口19并且与电极端子22,22一体化。圆周壁20和/或底壁21设置有通向传声器构件11的收音部15的通孔28，以闭合开口19和当麦克风构件11容纳在容纳空间12中时的音孔28。

9. 发明专利

JP2007321240A Heat dissipation material and its manufacturing method 有权
标题翻译：散热材料及其制造方法
公开(公告)号：JP2007321240A
公开(公告)日：2007-12-13
申请号：JP2006156652
申请日：2006-06-05
申请人： Yamaha Metanikusu Kk , ヤマハメタニクス株式会社
发明人： MIURA MICHIO
IPC分类号： C22C9/00 , B21B3/00 , B21C23/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation material having a thermal expansion coefficient lower than that of conventional copper alloys and also having high electric conductivity and also to provide its manufacturing method.
SOLUTION: The heat dissipation material is composed of a copper alloy having a composition consisting of 0.5 to 3.5 mass% Te and the balance Cu with inevitable impurities. Further, the copper alloy may contain ≤1 mass% B. The method for manufacturing the heat dissipation material comprises the following steps: a step of applying hot extrusion or hot rolling to an ingot of a copper alloy having a composition consisting of 0.5 to 3.5 mass% Te and the balance Cu with inevitable impurities to obtain a bar-like or plate-like copper alloy; a step of applying solution heat treatment to the bar-like or plate-like copper alloy; and a step of subjecting the solution heat treated copper alloy to cold drawing or to cold rolling to obtain a bar or a sheet.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有比常规铜合金低的热膨胀系数并且还具有高导电性的散热材料，并且还提供其制造方法。解决方案：散热材料由具有0.5-3.5质量％Te组成的铜合金和余量为不可避免的杂质的铜合金组成。此外，铜合金的含量≤1质量％B.散热材料的制造方法包括以下步骤：向具有0.5〜3.5的组成的铜合金的锭施加热挤压或热轧的工序质量％Te和余量Cu与不可避免的杂质，以获得棒状或板状铜合金; 对棒状或板状铜合金进行固溶热处理的工序; 以及将固溶热处理的铜合金冷拉或冷轧以获得棒或片的步骤。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP3621615B2 Microphone holder 有权
公开(公告)号：JP3621615B2
公开(公告)日：2005-02-16
申请号：JP32195599
申请日：1999-11-12
申请人：ヤマハメタニクス株式会社
发明人：訓享藤原 , 芳紀須藤
IPC分类号： H04R1/02 , H04M1/02 , H04M1/03 , H04R1/04 , H04R1/06 , H04R1/08 , H05K7/12
CPC分类号： H04R1/08 , H04R1/04 , H04R1/06

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