An MEMS device and a manufacturing method therefor. The MEMS device comprises: a surface acoustic wave filter, which comprises an interdigital transducer (11); a first structural layer (13), which is located above the surface acoustic wave filter; and a bulk acoustic wave filter, which comprises a bearing substrate (100), an acoustic reflection structure, which is located on the surface of the bearing substrate (100), and a piezoelectric laminated structure on the acoustic reflection structure, wherein the piezoelectric laminated structure comprises a first electrode (102), a piezoelectric layer (103) and a second electrode (104), which are laminated in sequence; and the first structural layer (13) has a first cavity (120a), and an effective resonance area of the piezoelectric laminated structure and the interdigital transducer of the surface acoustic wave filter cover the first cavity (120a). The first structural layer (13) having the first cavity (120a) is arranged between the surface acoustic wave filter and the bulk acoustic wave filter, such that the effective resonance area of the piezoelectric laminated structure and the interdigital transducer of the surface acoustic wave filter cover the first cavity together, thereby realizing vertical integration, reducing the package volume of the entire system, and realizing miniaturization and high integration.