发明申请
WO2022175439A1 VERFAHREN ZUR HERSTELLUNG EINES DECKELSUBSTRATS, VERFAHREN ZUR HERSTELLUNG EINES HERMETISCH GEHÄUSTEN, OPTOELEKTRONISCHEN BAUELEMENTS UND HERMETISCH GEHÄUSTES, OPTOELEKTRONISCHES BAUELEMENT
审中-公开
基本信息:
- 专利标题： VERFAHREN ZUR HERSTELLUNG EINES DECKELSUBSTRATS, VERFAHREN ZUR HERSTELLUNG EINES HERMETISCH GEHÄUSTEN, OPTOELEKTRONISCHEN BAUELEMENTS UND HERMETISCH GEHÄUSTES, OPTOELEKTRONISCHES BAUELEMENT
- 专利标题（英）：METHOD FOR PRODUCING A COVER SUBSTRATE, METHOD FOR PRODUCING A HERMETICALLY ENCLOSED, OPTOELECTRONIC COMPONENT AND HERMETICALLY ENCLOSED OPTOELECTRONIC COMPONENT
- 申请号：PCT/EP2022/054057 申请日：2022-02-18
- 公开(公告)号：WO2022175439A1 公开(公告)日：2022-08-25
- 发明人： REINERT, Wolfgang , STENCHLY, Vanessa , QUENZER, Hans-Joachim , KÄHLER, Dirk
- 申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
- 申请人地址： Hansastraße 27c
- 专利权人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
- 当前专利权人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
- 当前专利权人地址： Hansastraße 27c
- 代理机构： HERSINA, Günter et al.
- 优先权： EP21158288.7 2021-02-19
- 主分类号： C03B23/035
- IPC分类号： C03B23/035 ; C03B25/02 ; C03B40/00 ; C03C17/06 ; B81B7/00
The invention relates to a method (100) comprising the following steps: providing (120) a formed substrate and a covering substrate, which are connected to one another, wherein a surface region of the formed substrate and/or of the covering substrate is structured to form a closed cavity between the covering substrate and the formed substrate; annealing (130) the covering substrate and the formed substrate to reduce the viscosity of the glass material of the covering substrate; and providing (140) an overpressure in the closed cavity with respect to the ambient atmosphere to create, using the reduced viscosity of the glass material of the covering substrate and the overpressure in the closed cavity with respect to the ambient atmosphere, a defined bulge in the glass material of the covering substrate proceeding from the closed cavity to a stop surface of a stop element spaced with respect to the covering substrate to obtain a shaped covering substrate with a cover element; and removing the stop element and the formed substrate from the formed covering substrate.
IPC结构图谱:
| C | 化学；冶金 |
| --C03 | 玻璃；矿棉或渣棉 |
| ----C03B | 制造、成型或辅助工艺 |
| ------C03B23/00 | 初型玻璃的再成型 |
| --------C03B23/02 | .玻璃板的再成型 |
| ----------C03B23/023 | ..热弯法 |
| ------------C03B23/035 | ...利用气垫或改变气压法，如真空法 |