基本信息:
- 专利标题： SYSTEMS FOR SHIELDING BENT SIGNAL LINES
- 申请号：PCT/US2021/033923 申请日：2021-05-24
- 公开(公告)号：WO2021262369A1 公开(公告)日：2021-12-30
- 发明人： HAN, Jeahyeong , HWANG, Suhyung , ISKANDER, Mina , KUMAR, Rajneesh , JESSIE, Darryl, Sheldon
- 申请人： QUALCOMM INCORPORATED
- 申请人地址： Attn: International IP Administration
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： Attn: International IP Administration
- 代理机构： TERRANOVA, Steven, N.
- 优先权： US17/100,121 2020-11-20
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/14 ; H05K3/46 ; H05K1/0225 ; H05K1/0237 ; H05K1/148 ; H05K2201/0154 ; H05K2201/09336 ; H05K2201/09618 ; H05K2201/09681 ; H05K2201/10098 ; H05K3/4691
摘要：
Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines (322), the signal lines may be shielded. The shields may further include vias (314) connecting the mesh ground planes (114) and positioned exteriorly of the signal lines (322). The density of the vias (314) may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines (322) to help bending process accuracy.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |