发明申请
WO2021251819A1 METHOD AND MOULD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER
审中-公开
基本信息:
- 专利标题： METHOD AND MOULD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER
- 申请号：PCT/NL2021/050362 申请日：2021-06-08
- 公开(公告)号：WO2021251819A1 公开(公告)日：2021-12-16
- 发明人： GAL, Wilhelmus Gerardus Jozef , VENROOIJ, Johannes Lambertus Gerardus Maria , ROELOFSEN, Jan
- 申请人： BESI NETHERLANDS B.V.
- 申请人地址： Ratio 6
- 专利权人： BESI NETHERLANDS B.V.
- 当前专利权人： BESI NETHERLANDS B.V.
- 当前专利权人地址： Ratio 6
- 代理机构： PATENTWERK B.V.
- 优先权： NL2025807 2020-06-10
- 主分类号： B29C45/14
- IPC分类号： B29C45/14 ; H01L21/56 ; B29C45/76 ; B29C45/77 ; B29C45/14655 ; B29C45/7653 ; H01L21/565 ; H01L21/566
摘要：
The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.
IPC结构图谱:
| B | 作业；运输 |
| --B29 | 塑料的加工；一般处于塑性状态物质的加工 |
| ----B29C | 塑料的成型或连接；塑性状态物质的一般成型；已成型产品的后处理，如修整 |
| ------B29C45/00 | 注射成型，即迫使所需成型材料容量通过注口进入闭合的模型；所用的设备 |
| --------B29C45/14 | .插入预成型件或层，如在插入件周围注射成型或用于涂覆制品 |