基本信息:
- 专利标题： POST PROCESSING OF 3D PRINTED MATERIALS VIA MICROWAVE ENHANCED CHEMISTRY
- 申请号：PCT/EP2021/061628 申请日：2021-05-04
- 公开(公告)号：WO2021233671A1 公开(公告)日：2021-11-25
- 发明人： COBO CARDENETE, Isidro , ZEN, Federico , NOLAN, Darren
- 申请人： HENKEL IP & HOLDING GMBH
- 申请人地址： Henkelstraße 67
- 专利权人： HENKEL IP & HOLDING GMBH
- 当前专利权人： HENKEL IP & HOLDING GMBH
- 当前专利权人地址： Henkelstraße 67
- 代理机构： VIERING, JENTSCHURA & PARTNER MBB
- 优先权： EP20175821.6 2020-05-20
- 主分类号： H05B6/80
- IPC分类号： H05B6/80 ; B33Y10/00 ; B33Y30/00
摘要：
Post processing of 3D printed materials via microwave enhanced chemistry The present invention is directed to a method for post processing a 3D printed part, to a three- dimensional part fabricated in a method according to the present invention, and further to the use of a microwave oven in the post processing of a three-dimensional part fabricated in a 3D printing method.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05B | 电热；其他类目不包含的电照明 |
| ------H05B6/00 | 通过电场、磁场或电磁场加热的 |
| --------H05B6/02 | .感应加热 |
| ----------H05B6/80 | ..用于特定应用的设备 |