发明申请
WO2021167787A1 ETCHING OF GLASS SURFACES TO REDUCE ELECTROSTATIC CHARGING DURING PROCESSING
审中-公开
基本信息:
- 专利标题： ETCHING OF GLASS SURFACES TO REDUCE ELECTROSTATIC CHARGING DURING PROCESSING
- 申请号：PCT/US2021/016339 申请日：2021-02-03
- 公开(公告)号：WO2021167787A1 公开(公告)日：2021-08-26
- 发明人： FU, Hsueh-Hung , HONKAWA, Shinya , KIMURA, Mitsuo , VENKATACHALAM, Siva
- 申请人： CORNING INCORPORATED
- 申请人地址： 1 Riverfront Plaza
- 专利权人： CORNING INCORPORATED
- 当前专利权人： CORNING INCORPORATED
- 当前专利权人地址： 1 Riverfront Plaza
- 代理机构： ABLE, Kevin M.
- 优先权： US62/977,872 2020-02-18
- 主分类号： C03C15/00
- IPC分类号： C03C15/00 ; C09K13/00
摘要：
A method of treating a glass substrate including heating the glass substrate, directing a first flow of air through a first plurality of apertures disposed in an aperture plate to a first side of the heated glass substrate, and exposing a second side of the heated glass substrate to a treatment fluid including HF while directing the first flow of air, the treatment fluid etching the second side of the glass substrate to form a treated glass substrate.
IPC结构图谱:
| C | 化学；冶金 |
| --C03 | 玻璃；矿棉或渣棉 |
| ----C03C | 玻璃、釉或搪瓷釉的化学成分；玻璃的表面处理；由玻璃、矿物或矿渣制成的纤维或细丝的表面处理；玻璃与玻璃或与其他材料的接合 |
| ------C03C15/00 | 纤维和丝之外的蚀刻法玻璃表面处理 |