基本信息:
- 专利标题： WAFER CLAMP HARD BURL PRODUCTION AND REFURBISHMENT
- 申请号：PCT/EP2020/085107 申请日：2020-12-08
- 公开(公告)号：WO2021130015A1 公开(公告)日：2021-07-01
- 发明人： LIPSON, Matthew , AKBAS, Mehmet, Ali , UITTERDIJK, Tammo , ZHAO, Fei
- 申请人： ASML HOLDING N.V.
- 申请人地址： P.O. Box 324
- 专利权人： ASML HOLDING N.V.
- 当前专利权人： ASML HOLDING N.V.
- 当前专利权人地址： P.O. Box 324
- 代理机构： ASML NETHERLANDS B.V.
- 优先权： US62/953,730 2019-12-26
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; H01L21/687 ; G03F7/707 ; G03F7/70975 ; H01L21/6875 ; H01L21/68757
摘要：
Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).