发明申请
WO2021090951A1 金属端子用接着性フィルム、金属端子用接着性フィルムの製造方法、金属端子用接着性フィルム付き金属端子、当該金属端子用接着性フィルムを用いた蓄電デバイス、及び蓄電デバイスの製造方法
审中-公开
基本信息:
- 专利标题： 金属端子用接着性フィルム、金属端子用接着性フィルムの製造方法、金属端子用接着性フィルム付き金属端子、当該金属端子用接着性フィルムを用いた蓄電デバイス、及び蓄電デバイスの製造方法
- 专利标题（英）：ADHESIVE FILM FOR METAL TERMINAL, METHOD FOR MANUFACTURING ADHESIVE FILM FOR METAL TERMINAL, METAL TERMINAL WITH ADHESIVE FILM FOR METAL TERMINAL, POWER STORAGE DEVICE USING ADHESIVE FILM FOR METAL TERMINAL, AND METHOD FOR MANUFACTURING POWER STORAGE DEVICE
- 申请号：PCT/JP2020/041773 申请日：2020-11-09
- 公开(公告)号：WO2021090951A1 公开(公告)日：2021-05-14
- 发明人： 加藤 貴大 , 望月 洋一
- 申请人： 大日本印刷株式会社
- 申请人地址： 〒1628001 東京都新宿区市谷加賀町一丁目１番１号 Tokyo
- 专利权人： 大日本印刷株式会社
- 当前专利权人： 大日本印刷株式会社
- 当前专利权人地址： 〒1628001 東京都新宿区市谷加賀町一丁目１番１号 Tokyo
- 代理机构： 田中 順也
- 优先权： JP2019-203559 2019-11-08
- 主分类号： H01G11/74
- IPC分类号： H01G11/74 ; H01G11/80 ; H01M50/172 ; H01M50/183 ; H01M50/543
The present invention pertains to an adhesive film for metal terminals and the purpose of the present invention is to provide an adhesive film for metal terminals which has excellent adhesion to metal terminals. The adhesive film for metal terminals is interposed between a metal terminal connected to an electrode of a power storage device element and a power storage device external member, and comprises, in the following order, a first polyolefin layer, a substrate, and a second polyolefin layer disposed on the metal terminal side. A sea-island structure is observed in a sectional image of the first polyolefin layer in a direction parallel to TD, the sectional image being obtained in the range of up to 30% of the thickness of the first polyolefin layer from the surface on the metal terminal side. In the sectional image, after the adhesive film for metal terminals is left to stand for 12 seconds in a heated and pressurized environment in which the temperature is 190°C and the surface pressure is 0.016 MPa, and further left to stand for one hour in an environment in which the temperature is 25°C, the of the total area of the island portions of the sea-island structure is 25.0% to 35.0%.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01G | 电容器；电解型的电容器、整流器、检波器、开关器件、光敏器件或热敏器件 |
| ------H01G11/00 | 混合电容器，即具有不同正极和负极的电容器；双电层（EDL）电容器；其制造方法或其零部件的制造方法 |
| --------H01G11/74 | .端子，如集电体的延伸 |