基本信息:
- 专利标题： 반도체 발광소자의 자가조립 장치 및 방법
- 专利标题（英）：APPARATUS AND METHOD FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DEVICE
- 申请号：PCT/KR2019/013158 申请日：2019-10-08
- 公开(公告)号：WO2020085677A1 公开(公告)日：2020-04-30
- 发明人： 최주찬 , 김지덕 , 심봉주 , 이슬빛나 , 전기성 , 조현우
- 申请人： 엘지전자 주식회사
- 申请人地址： 07336 서울시 영등포구 여의대로 128, Seoul KR
- 专利权人： 엘지전자 주식회사
- 当前专利权人： 엘지전자 주식회사
- 当前专利权人地址： 07336 서울시 영등포구 여의대로 128, Seoul KR
- 代理机构： 박장원
- 优先权： KR10-2018-0128474 20181025
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L25/075 ; H01L25/16 ; H01L33/00 ; H01L33/06 ; H01L33/20 ; H01L33/30 ; H01L33/38
The present invention provides an apparatus for self-assembling a semiconductor light-emitting device, comprising: a fluid chamber having a space for accommodating a plurality of semiconductor light-emitting devices each having a magnetic body; a magnet for applying magnetic force to the semiconductor light-emitting devices while a substrate is disposed at an assembly position; a power supply unit for inducing electric field formation on the substrate such that the semiconductor light-emitting devices are seated at a predetermined position of the substrate in the process of moving by a position change of the magnet; and a fluid injector for injecting fluid into some of the semiconductor light-emitting devices seated on the substrate such that some of the semiconductor light-emitting devices are separated from the substrate.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |