A method of assembling a semiconductor power module component (30) and a manufacturing system comprising such a semiconductor power module component and a pressing apparatus (20) for manufacturing a semiconductor power module component are described. The semiconductor power module component (30) comprises at least a first element (1) (e.g. a semiconductor chip), a second element (2) (e.g. a substrate, such a DCB substrate) and a third element (3) (e.g. a base plate) arranged in a stack (10). The first element (1) and the second element (2) are joined by sintering in a sintering area (4) and the second element (2) and the third element (3) are joined by soldering in a soldering area (6). The sintering and the soldering are simultaneously executed, wherein the soldering area (6) is heated to a temperature of soldering and the sintering area (4) is heated to a temperature of sintering, the temperature of soldering and the temperature of sintering being harmonized to each other. Pressure is being applied to the stack (10), comprising the at least one soldering area (6) and the at least one sintering area (4) with stabilizing means (7) such as bumps on a surface of the second element (2) or third element (3), solid spacer means incorporated in a solder perform (8) or a wire mesh incorporated in a solder preform (8) being arranged in the soldering area (6). Additional component parts (14, 15) may be sintered onto the first element and/or the second element simultaneously with the sintering and the soldering of the stack (10). The pressure may be applied by a soft cushion-like element (23) surrounding component parts (1, 2, 3, 14, 15) of the module (30).