基本信息:
- 专利标题： 반도체 패키지용 열경화성 수지 조성물 및 이를 이용한 프리프레그
- 专利标题（英）：THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG USING SAME
- 申请号：PCT/KR2019/001631 申请日：2019-02-11
- 公开(公告)号：WO2019160287A8 公开(公告)日：2019-08-22
- 发明人： 문화연 , 심창보 , 심희용 , 민현성 , 김원기
- 申请人： 주식회사 엘지화학
- 申请人地址： 07336 서울시 영등포구 여의대로 128, Seoul
- 专利权人： 주식회사 엘지화학
- 当前专利权人： 주식회사 엘지화학
- 当前专利权人地址： 07336 서울시 영등포구 여의대로 128, Seoul
- 代理机构： 유미특허법인
- 优先权： KR10-2018-0018020 2018-02-13
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; H05K1/03 ; C08L79/02 ; C08L79/04 ; C08L79/08 ; C08K3/013 ; C08L65/00 ; C08J5/24 ; B32B15/08 ; B32B15/043 ; B32B15/12 ; B32B15/14 ; B32B15/18 ; B32B15/20 ; B32B2250/03 ; B32B2250/40 ; B32B2260/021 ; B32B2260/028 ; B32B2260/046 ; B32B2262/02 ; B32B2262/0261 ; B32B2262/0269 ; B32B2262/0276 ; B32B2262/062 ; B32B2262/101 ; B32B2264/101 ; B32B2264/102 ; B32B2264/12 ; B32B2307/30 ; B32B2307/538 ; B32B2307/728 ; B32B2307/732 ; B32B2457/08 ; B32B2457/14 ; B32B2553/00 ; B32B27/20 ; B32B5/022 ; B32B5/024 ; B32B5/028 ; C08G14/06 ; C08G73/0253 ; C08J2363/00 ; C08J2379/08 ; C08J2463/00 ; C08J2479/04 ; C08J2479/08 ; C08J2481/06 ; C08J5/043 ; C08J5/121 ; C08L2203/20 ; C08L2205/025 ; C08L2205/035 ; C08L61/34 ; C08L79/085 ; H01L23/145 ; H05K1/0366
The present invention relates to a thermosetting resin composition, for a semiconductor package, having excellent flowability and stiffness, and a prepreg using same. More particularly, provided are a thermosetting resin composition for a semiconductor package, a prepreg using same, and a metal foil laminate including the prepreg, wherein the composition includes three specific fillers having different average particle diameters in a binder resin system containing epoxy resin, bismaleimide resin, diaminodiphenyl sulfone resin, and benzoxazine resin, thereby being able to ensure excellent flowability and stiffness even when the amount of filler is higher than that of the prior art, and to contribute to the driving properties of a slim electronic device.
公开/授权文献:
- WO2019160287A1 반도체 패키지용 열경화성 수지 조성물 및 이를 이용한 프리프레그 公开/授权日：2019-08-22
IPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L63/00 | 环氧树脂的组合物；环氧树脂衍生物的组合物 |