基本信息:
- 专利标题： PRINTED CIRCUIT BOARD SOLDER JOINTS
- 申请号：PCT/US2018/040356 申请日：2018-06-29
- 公开(公告)号：WO2019006344A1 公开(公告)日：2019-01-03
- 发明人： KNAUSS, Matthew , LEDYARD, Roland L.
- 申请人： LUTRON ELECTRONICS CO., INC.
- 申请人地址： 7200 Suter Road Coopersburg, Pennsylvania 18036 US
- 专利权人： LUTRON ELECTRONICS CO., INC.
- 当前专利权人： LUTRON ELECTRONICS CO., INC.
- 当前专利权人地址： 7200 Suter Road Coopersburg, Pennsylvania 18036 US
- 代理机构： FARBANISH, Glen R.
- 优先权： US62/527,554 20170630
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H05K3/30 ; H05K3/36
摘要：
A printed circuit board (PCB) assembly may include a motherboard PCB with one or more plated holes and a daughterboard PCB with one or more plated fingers extending from a lower edge of the daughterboard PCB. The plated fingers may have a rectangular and/or square cross section. The plated fingers may be plated on four sides that define the rectangular cross section. Each of the plated holes may be configured to receive a respective plated finger, for example, such that a lower portion of the plated fingers extend beyond a lower surface of the motherboard PCB. Each of the plated holes may be configured to be electrically connected to a respective plated finger via a solder joint. The solder joint may extend around the respective plated finger. The solder joints for the plated fingers may be configured to secure the daughterboard PCB to the motherboard PCB.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/14 | ..两个或更多个印刷电路的结构连接 |