发明申请
WO2017040539A1 SUBSTRATE COMPRISING AN EMBEDDED INDUCTOR INCLUDING A THIN FILM MAGNETIC CORE
审中-公开
基本信息:
- 专利标题： SUBSTRATE COMPRISING AN EMBEDDED INDUCTOR INCLUDING A THIN FILM MAGNETIC CORE
- 专利标题（中）：封装包括薄膜磁芯的嵌入式电感器的基板
- 申请号：PCT/US2016/049512 申请日：2016-08-30
- 公开(公告)号：WO2017040539A1 公开(公告)日：2017-03-09
- 发明人： YUN, Changhan Hobie , VELEZ, Mario Francisco , ZUO, Chengjie , KIM, Daeik Daniel , BERDY, David Francis , LAN, Je-Hsiung Jeffrey , KIM, Jonghae , MUDAKATTE, Niranjan Sunil , MIKULKA, Robert Paul
- 申请人： QUALCOMM INCORPORATED
- 申请人地址： ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- 代理机构： THAVONEKHAM, S. Sean
- 优先权： US14/841,132 20150831
- 主分类号： H01L23/64
- IPC分类号： H01L23/64 ; H01F17/00 ; H01F41/04 ; H01F41/32 ; H05K1/16
摘要：
A substrate includes a first dielectric layer, a magnetic core at least partially in the first dielectric layer, where the magnetic core comprises a first non-horizontal thin film magnetic (TFM) layer. The substrate also includes a first inductor that includes a plurality of first interconnects, where the first interconnects are positioned in the substrate to at least partially surround the magnetic core. The magnetic core may further include a second non-horizontal thin film magnetic (TFM) layer. The magnetic core may further include a core layer. The magnetic core may further include a third thin film magnetic (TFM) layer, and a fourth thin film magnetic (TFM) layer that is substantially parallel to the third thin film magnetic (TFM) layer.
摘要（中）：
衬底包括第一电介质层，至少部分地在第一介电层中的磁芯，其中磁芯包括第一非水平薄膜磁性（TFM）层。 衬底还包括包括多个第一互连件的第一电感器，其中第一互连件位于衬底中以至少部分地围绕磁芯。 磁芯还可以包括第二非水平薄膜磁性（TFM）层。 磁芯还可以包括芯层。 磁芯还可以包括第三薄膜磁性（TFM）层和基本上平行于第三薄膜磁性（TFM）层的第四薄膜磁性（TFM）层。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/64 | ..阻抗装置 |