基本信息:
- 专利标题： PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM
- 专利标题（中）：镀钯组合物和钯化学镀方法
- 申请号：PCT/EP2015080136 申请日：2015-12-17
- 公开(公告)号：WO2016097083A2 公开(公告)日：2016-06-23
- 发明人： WALTER ANDREAS , MUSKULUS KATHARINA
- 申请人： ATOTECH DEUTSCHLAND GMBH
- 专利权人： ATOTECH DEUTSCHLAND GMBH
- 当前专利权人： ATOTECH DEUTSCHLAND GMBH
- 优先权： EP14198654 2014-12-17
- 主分类号： C23C18/44
- IPC分类号： C23C18/44
摘要：
The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
摘要（中）：
本发明涉及一种含水电镀液组合物和一种通过无电镀在衬底上沉积钯层的方法。 本发明的水系镀浴组合物含有钯离子源，钯离子还原剂和芳香族化合物。 含水电镀液组合物具有提高的钯沉积速率，同时保持浴稳定性。 含水电镀液组合物也具有延长的使用寿命。 本发明的芳族化合物允许在浴寿命期间将沉积速率调节到恒定的范围并且在较低的温度下无电沉积钯层。 本发明的芳族化合物激活具有低沉积速率的无电镀钯浴并重新激活老化的无电镀钯浴。