发明申请
WO2016020398A1 ADHESION PROMOTING MATERIAL-COATED ELECTRICALLY CONDUCTIVE CARRIER WITH THERMALLY CONDUCTIVE LAYER
审中-公开
基本信息:
- 专利标题: ADHESION PROMOTING MATERIAL-COATED ELECTRICALLY CONDUCTIVE CARRIER WITH THERMALLY CONDUCTIVE LAYER
- 专利标题(中):粘合促进材料涂层电导体载体与导热层
- 申请号:PCT/EP2015/067983 申请日:2015-08-04
- 公开(公告)号:WO2016020398A1 公开(公告)日:2016-02-11
- 发明人: KREUTZWIESNER, Elisabeth , SCHULZ, Gernot
- 申请人: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- 申请人地址: Fabriksgasse 13 A-8700 Leoben AT
- 专利权人: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- 当前专利权人: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- 当前专利权人地址: Fabriksgasse 13 A-8700 Leoben AT
- 代理机构: SCHINDELMANN, Peter
- 优先权: DE10 20140805
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/02
摘要:
A composite structure (100) for use as a constituent of a mounting device (300), wherein the composite structure (100) comprises an electrically conductive carrier (102), an intermediate layer (104) comprising adhesion promoting material and being arranged on the electrically conductive carrier (102), and a thermally conductive and electrically insulating layer (106) on the intermediate layer (104).
摘要(中):
一种用作安装装置(300)的组成部分的复合结构(100),其中所述复合结构(100)包括导电载体(102),包含粘附促进材料的中间层(104) 导电载体(102)和中间层(104)上的导热和电绝缘层(106)。
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K1/00 | 印刷电路 |
--------H05K1/02 | .零部件 |