基本信息:
- 专利标题： SYSTEM FOR ATTACHING DEVICES TO FLEXIBLE SUBSTRATES
- 专利标题（中）：用于将设备附接到柔性基板的系统
- 申请号：PCT/US2014051627 申请日：2014-08-19
- 公开(公告)号：WO2015034664A2 公开(公告)日：2015-03-12
- 发明人： SPEER RICHARD S , HAMBY DAVID , SCOTCH ADAM M
- 申请人： OSRAM SYLVANIA INC
- 专利权人： OSRAM SYLVANIA INC
- 当前专利权人： OSRAM SYLVANIA INC
- 优先权： US201314017439 2013-09-04
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
This disclosure is directed to a system for attaching devices to flexible substrates. A device may be coupled to a flexible substrate in a manner that prevents adhesive from contacting conductive ink while the adhesive is harmful. If conductive epoxy is used to anchor conductive pads in the device to the flexible substrate, conductive epoxy may be applied beyond the edge of the device over which conductive ink may be applied to make electrical connections. Holes may also be formed in the flexible substrate allowing conductive epoxy to be exposed on a surface of the flexible substrate opposite to the device location, the conductive ink connections being made on the opposite surface. The conductive ink may also be applied directly to the conductive pads when extended beyond the device's edge. The flexible substrate may be preprinted with circuit paths, the conductive ink coupling the device to the circuit paths.
摘要（中）：
本公开涉及用于将装置附接到柔性基板的系统。 装置可以以防止粘合剂接触导电油墨同时粘合剂有害的方式耦合到柔性基底。 如果使用导电环氧树脂将装置中的导电垫锚定到柔性衬底，则可以在装置的边缘之上施加导电环氧树脂，在该装置的边缘上可以施加导电油墨以形成电连接。 还可以在柔性基板中形成孔，从而允许导电环氧树脂暴露在柔性基板的与设备位置相对的表面上，导电油墨连接在相反的表面上形成。 当延伸超出装置的边缘时，导电墨水也可以直接施加到导电垫上。 柔性衬底可以预印有电路路径，导电墨水将器件耦合到电路路径。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |