发明申请
WO2014138181A1 SYSTEMS AND METHODS FOR HARVESTING DISSIPATED HEAT FROM INTEGRATED CIRCUITS (ICS) IN ELECTRONIC DEVICES INTO ELECTRICAL ENERGY FOR PROVIDING POWER FOR THE ELECTRONIC DEVICES
审中-公开
基本信息:
- 专利标题： SYSTEMS AND METHODS FOR HARVESTING DISSIPATED HEAT FROM INTEGRATED CIRCUITS (ICS) IN ELECTRONIC DEVICES INTO ELECTRICAL ENERGY FOR PROVIDING POWER FOR THE ELECTRONIC DEVICES
- 专利标题（中）：用于将电子设备中的集成电路（ICS）中的散热加热到用于为电子设备提供电力的电能的系统和方法
- 申请号：PCT/US2014/020602 申请日：2014-03-05
- 公开(公告)号：WO2014138181A1 公开(公告)日：2014-09-12
- 发明人： ARYAN, Babak , GOVINDASWAMY, Senthil, Kumar , RANGAN, Venkat
- 申请人： QUALCOMM INCORPORATED
- 申请人地址： 5775 Morehouse Drive San Diego, California 92121 US
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： 5775 Morehouse Drive San Diego, California 92121 US
- 代理机构： TERRANOVA, Steven, N.
- 优先权： US61/774,039 20130307; US13/924,687 20130624
- 主分类号： H01L35/32
- IPC分类号： H01L35/32 ; H05K1/18
摘要：
Systems and methods for harvesting dissipated heat from integrated circuits (ICs) in electronic devices into electrical energy for providing power for the electronic devices are disclosed. In one embodiment, energy transferred from one or more ICs in the form of dissipated heat is harvested to convert at least a portion of this dissipated heat into electricity. This power can be used to provide power to the ICs to reduce overall power consumption by the electronic device. The harvested dissipated heat can be supplied to ICs in the electronic device to provide power to the ICs. Alternatively, or in addition, the harvested dissipated heat can be stored in an energy storage device to provide power to the ICs at a later time.
摘要（中）：
公开了用于从电子设备中的集成电路（IC）将耗散的热量收集到用于为电子设备供电的电能的系统和方法。 在一个实施例中，收集从散热形式的一个或多个IC转移的能量，以将该散热的至少一部分转化成电。 该功率可用于为IC提供电力以减少电子设备的总功耗。 所获得的耗散的热量可以提供给电子设备中的IC以向IC提供电力。 或者或另外，收获的耗散热量可以存储在能量存储装置中，以在稍后的时间向IC提供电力。