基本信息:
- 专利标题: COOLING SYSTEM WITH REDUNDANCY
- 专利标题(中):冷却系统与冗余
- 申请号:PCT/GB2014/050616 申请日:2014-03-03
- 公开(公告)号:WO2014132086A1 公开(公告)日:2014-09-04
- 发明人: BENT, Jason , DEAKIN, Keith , HOPTON, Peter
- 申请人: ICEOTOPE LIMITED , KAHN, Simon
- 申请人地址: Martello Court Admirial Park St Peter Port Guernsey GY1 3HB GB
- 专利权人: ICEOTOPE LIMITED,KAHN, Simon
- 当前专利权人: ICEOTOPE LIMITED,KAHN, Simon
- 当前专利权人地址: Martello Court Admirial Park St Peter Port Guernsey GY1 3HB GB
- 代理机构: BOULT WADE TENNANT
- 优先权: GB1303643.9 20130301
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A cooling apparatus comprises: an interfacing component that receives an electronic device and defines a convective thermal interface through which heat generated by the electronic device can be transferred via an inner coolant; and a heat exchanger arrangement, coupled to the convective thermal interface that transfers heat generated by the electronic device via the thermal interface to first and second isolated heat sinks. In the event that a part of the heat exchanger arrangement is unable to transfer heat to the first heat sink, it transfers at least some of the heat that would have been transferred to the first heat sink to the second heat sink. The heat exchanger arrangement comprises: a first coolant connector, receiving a first outer coolant as part of the first heat sink; and a second coolant connector, receiving a second outer coolant as part of the second heat sink.
摘要(中):
冷却装置包括:接口部件,其接收电子设备并且限定对流热接口,经由内部冷却剂可以传递由电子设备产生的热量; 以及耦合到对流热界面的热交换器装置,其将由电子装置产生的热量经由热界面传递到第一和第二隔离散热器。 在热交换器装置的一部分不能将热量传递到第一散热器的情况下,其将至少一些已经被传递到第一散热器的热量传递到第二散热器。 所述热交换器装置包括:第一冷却剂连接器,其接收作为所述第一散热器的一部分的第一外部冷却剂; 以及第二冷却剂连接器,其接收作为所述第二散热器的一部分的第二外部冷却剂。
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
--------H05K7/20 | .便于冷却、通风或加热的改进 |