基本信息:
- 专利标题： THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- 专利标题（中）：薄膜处理和已知良好的测试方法
- 申请号：PCT/US2013055613 申请日：2013-08-19
- 公开(公告)号：WO2014031547A2 公开(公告)日：2014-02-27
- 发明人： WOYCHIK CHARLES , YANG SE YOUNG , MONADGEMI PEZHMAN , CASKEY TERRENCE , UZOH CYPRIAN EMEKA
- 申请人： INVENSAS CORP
- 专利权人： INVENSAS CORP
- 当前专利权人： INVENSAS CORP
- 优先权： US201213593118 2012-08-23
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.
摘要（中）：
将微电子元件附接到衬底的方法可以包括将衬底与微电子元件对准，微电子元件具有多个间隔开的导电凸块，每个包括接合金属，并且回流凸块。 凸起可以暴露在微电子元件的前表面处。 衬底可以具有从其第一表面延伸的多个间隔开的凹部。 这些凹部各自可以具有一个或多个内表面的至少一部分，该内表面不被其形成凸点的粘合金属润湿。 可以进行凸块的回流，使得每个凸块的至少一些粘结金属液化并且至少部分地流入其中一个凹部并在其中固化，使得至少一些凹部中的回流焊接材料机械地接合 基质。