基本信息:
- 专利标题: FABRICATION OF THREE-DIMENSIONAL PRINTED CIRCUIT BOARD STRUCTURES
- 专利标题(中):三维印刷电路板结构的制造
- 申请号:PCT/CN2011/082471 申请日:2011-11-18
- 公开(公告)号:WO2013071519A1 公开(公告)日:2013-05-23
- 发明人: WANG, Nan , NYHUS, Orville
- 申请人: HONEYWELL INTERNATIONAL INC. , WANG, Nan , NYHUS, Orville
- 申请人地址: 101 Columbia Road, P.O. Box 2245 Morristown, New Jersey 07962-2245 US
- 专利权人: HONEYWELL INTERNATIONAL INC.,WANG, Nan,NYHUS, Orville
- 当前专利权人: HONEYWELL INTERNATIONAL INC.,WANG, Nan,NYHUS, Orville
- 当前专利权人地址: 101 Columbia Road, P.O. Box 2245 Morristown, New Jersey 07962-2245 US
- 代理机构: CHINA PATENT AGENT (H.K.) LTD.
- 主分类号: H05K3/36
- IPC分类号: H05K3/36 ; H05K1/14 ; H04L29/00
摘要:
A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (PCB) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to an edge of the end section and dividing the end section into a first end portion and a second end portion. The PCB material is removed from the top surface at the first end portion to form a first support member having an upper surface at a preselected distance below the top surface. A second angled channel is formed in the bottom surface at the end section of the first PCB, with the second angled channel extending to the edge of the end section and being adjacent to the first support member. The PCB material is removed from the bottom surface at the second end portion to form a second support member having an upper surface that is contiguous with the top surface of the PCB. A ramp portion extends between the first support member and the second support member.
摘要(中):
一种制造用于三维电路结构的组件的方法包括提供具有顶表面,相对的底表面和端部的印刷电路板(PCB)。 第一倾斜通道形成在端部的顶表面中,第一倾斜通道延伸到端部部分的边缘并且将端部部分分成第一端部部分和第二端部部分。 所述PCB材料在所述第一端部处从所述顶表面移除以形成第一支撑构件,所述第一支撑构件具有在所述顶表面下方预定距离的上表面。 在第一PCB的端部处的底表面中形成第二倾斜通道,第二倾斜通道延伸到端部部分的边缘并与第一支撑构件相邻。 所述PCB材料在所述第二端部处从所述底表面移除以形成具有与所述PCB的顶表面邻接的上表面的第二支撑构件。 斜坡部分在第一支撑构件和第二支撑构件之间延伸。
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/36 | .印刷电路与其他印刷电路的组装 |