发明申请
WO2013016652A1 LIGHTING DEVICE UTILIZING LIGHT ACTIVE SHEET MATERIAL WITH INTEGRATED LIGHT EMITTING DIODE, DISPOSED IN SEAM AND/OR IN LOW PROFILE APPLICATION
审中-公开
基本信息:
- 专利标题： LIGHTING DEVICE UTILIZING LIGHT ACTIVE SHEET MATERIAL WITH INTEGRATED LIGHT EMITTING DIODE, DISPOSED IN SEAM AND/OR IN LOW PROFILE APPLICATION
- 专利标题（中）：照明装置利用具有集成的发光二极管的光活性片材料，在海底和/或低配置文件应用中处理
- 申请号：PCT/US2012/048584 申请日：2012-07-27
- 公开(公告)号：WO2013016652A1 公开(公告)日：2013-01-31
- 发明人： MARX, Martin, J. , BOZICH, Richard, C. , ROBBINS, Stanley, D. , ROBERTS, James, E. , EHLERS, Jennifer, M.
- 申请人： GROTE INDUSTRIES, LLC , MARX, Martin, J. , BOZICH, Richard, C. , ROBBINS, Stanley, D. , ROBERTS, James, E. , EHLERS, Jennifer, M.
- 申请人地址： 2600 Lanier Drive Madison, IN 47250 US
- 专利权人： GROTE INDUSTRIES, LLC,MARX, Martin, J.,BOZICH, Richard, C.,ROBBINS, Stanley, D.,ROBERTS, James, E.,EHLERS, Jennifer, M.
- 当前专利权人： GROTE INDUSTRIES, LLC,MARX, Martin, J.,BOZICH, Richard, C.,ROBBINS, Stanley, D.,ROBERTS, James, E.,EHLERS, Jennifer, M.
- 当前专利权人地址： 2600 Lanier Drive Madison, IN 47250 US
- 代理机构： STEPHENSON, Cynthia, K. et al.
- 优先权： US61/512,272 20110727
- 主分类号： H01L27/00
- IPC分类号： H01L27/00
摘要：
A light source includes a substrate arranged into at least two facing surfaces (3811, 3813) which form a seam therebetween; and a lighting device (3803) with light emitting diode (LED) chips embedded therein in a linear arrangement. The LED chips generate light photons. The lighting device has a first edge and a second edge opposite to the first edge, the light photons within the lighting device that are emitted by the LED chips from a top surface of the LED chips being output from the lighting device at the second edge of the device. The lighting device (3803) is sandwiched in the seam between the two facing surfaces (3811, 3813), the second edge of the lighting device being exposed when the seam is in an opened position.
摘要（中）：
光源包括布置在至少两个相对表面（3811,3813）中的基板，其在它们之间形成接缝; 以及以线性排列嵌入其中的发光二极管（LED）芯片的照明装置（3803）。 LED芯片产生光子。 照明装置具有与第一边缘相对的第一边缘和第二边缘，在LED芯片的顶表面处由LED芯片发射的照明装置内的光子从LED芯片的顶表面在第二边缘的第二边缘处从照明装置输出 装置。 照明装置（3803）被夹在两个相对表面（3811,3813）之间的接缝中，当接缝处于打开位置时，照明装置的第二边缘被暴露。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |