发明申请
WO2012058351A1 OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION
审中-公开
基本信息:
- 专利标题： OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION
- 专利标题（中）：过氧化物复合材料结构及其制备方法
- 申请号：PCT/US2011/057952 申请日：2011-10-27
- 公开(公告)号：WO2012058351A1 公开(公告)日：2012-05-03
- 发明人： ELIA, Andri, E. , KIRCHNER, Olaf, Norbert , MESAROS, David, V. , WAKEMAN, Martyn, Douglas , YUAN, Shengmei
- 申请人： E. I. du Pont de Nemours and Company , ELIA, Andri, E. , KIRCHNER, Olaf, Norbert , MESAROS, David, V. , WAKEMAN, Martyn, Douglas , YUAN, Shengmei
- 申请人地址： 1007 Market Street Wilmington, DE 19898 US
- 专利权人： E. I. du Pont de Nemours and Company,ELIA, Andri, E.,KIRCHNER, Olaf, Norbert,MESAROS, David, V.,WAKEMAN, Martyn, Douglas,YUAN, Shengmei
- 当前专利权人： E. I. du Pont de Nemours and Company,ELIA, Andri, E.,KIRCHNER, Olaf, Norbert,MESAROS, David, V.,WAKEMAN, Martyn, Douglas,YUAN, Shengmei
- 当前专利权人地址： 1007 Market Street Wilmington, DE 19898 US
- 代理机构： SEBREE, Chyrrea, J.
- 优先权： US61/410,108 20101104; US61/410,104 20101104; US61/410,100 20101104; US61/410,093 20101104; US61/408,166 20101029
- 主分类号： B32B5/26
- IPC分类号： B32B5/26 ; B32B27/12 ; B32B27/34 ; B32B17/02 ; B32B17/10 ; C08J5/04 ; C08L77/00 ; C08L77/02 ; C08L77/04 ; C08L77/06 ; C08L77/08 ; B29C70/50 ; B29C70/68 ; C08J5/18
摘要：
The present invention relates to the field of overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, which surface has at least a portion made of a surface resin composition, and comprising a fibrous material selected from non-woven structures, textiles, fibrous battings and combinations thereof, said fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, wherein said second component is adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition and the surface resin composition are identical or different and are selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected from group (I) polyamides, and (B) one or more semiaromatic polyamides selected from group (II) polyamides having a melting point of at least 280°C.
摘要（中）：
本发明涉及包覆成型聚酰胺复合材料结构及其制备方法。 所公开的包覆成型的复合结构包括：i）具有表面的第一部件，该表面具有由表面树脂组合物制成的至少一部分，并且包括选自无纺布结构，纺织品，纤维棉条及其组合的纤维材料，所述 纤维材料用基质树脂组合物浸渍，ii）包含包覆成型树脂组合物的第二组分，其中所述第二组分在所述第一组分的表面的至少一部分上粘附到所述第一组分，并且其中所述基质树脂组合物 表面树脂组合物相同或不同，并且选自聚酰胺组合物，其包含（A）选自（I）聚酰胺的一种或多种完全脂族聚酰胺和（B）选自组（II）的一种或多种半芳族聚酰胺的共混物 ）聚酰胺，其熔点至少为280℃。
IPC结构图谱:
| B | 作业；运输 |
| --B32 | 层状产品 |
| ----B32B | 层状产品，即由扁平的或非扁平的薄层，例如泡沫状的、蜂窝状的薄层构成的产品 |
| ------B32B5/00 | 以非同质性或物理结构薄层为特征的层状产品 |
| --------B32B5/18 | .以含有泡沫材料或特殊多孔材料的薄层特性为特征的 |
| ----------B32B5/24 | ..一层是纤维或细丝薄层 |
| ------------B32B5/26 | ...另一层也是纤维或细丝薄层 |