发明申请
WO2012046179A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS
审中-公开
基本信息:
- 专利标题： AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS
- 专利标题（中）：水性抛光组合物和具有图形或未加工的低K介电层的化学机械抛光底材的工艺
- 申请号：PCT/IB2011/054344 申请日：2011-10-04
- 公开(公告)号：WO2012046179A1 公开(公告)日：2012-04-12
- 发明人： RAMAN, Vijay, Immanuel , RITTIG, Frank , LI, Yuzhuo , Chiu, Wei Lan William
- 申请人： BASF SE , RAMAN, Vijay, Immanuel , RITTIG, Frank , LI, Yuzhuo , Chiu, Wei Lan William , BASF (CHINA) COMPANY LIMITED
- 申请人地址： 67056 Ludwigshafen DE
- 专利权人： BASF SE,RAMAN, Vijay, Immanuel,RITTIG, Frank,LI, Yuzhuo,Chiu, Wei Lan William,BASF (CHINA) COMPANY LIMITED
- 当前专利权人： BASF SE,RAMAN, Vijay, Immanuel,RITTIG, Frank,LI, Yuzhuo,Chiu, Wei Lan William,BASF (CHINA) COMPANY LIMITED
- 当前专利权人地址： 67056 Ludwigshafen DE
- 代理机构： BASF SE
- 优先权： EP10186886.7 20101007; US61/390,639 20101007
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; H01L21/306
摘要：
An aqueous polishing composition comprising (A) abrasive particles and (B) an amphiphilic nonionic surfactant selected from the group consisting of water-soluble or water-dispersible surfactants having (b1) hydrophobic groups selected from the group consisting of branched alkyl groups having 10 to 18 carbon atoms; and (b2) hydrophilic groups selected from the group consisting of polyoxyalkylene groups comprising (b21 ) oxyethylene monomer units and (b22) substituted oxyalkylene monomer units wherein the substituents are selected from the group consisting of alkyl, cycloalkyl, or aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-aryl and alkyl-cycloalkyl-aryl groups, the said polyoxyalkylene group containing the monomer units (b21 ) and (b22) in random, alternating, gradient and/or blocklike distribution; a CMP process for substrates having patterned or unpatterned low-k or ultra-low-k dielectric layers making use of the said aqueous polishing composition; and the use of the said aqueous polishing composition for manufacturing electrical, mechanical and optical devices.
摘要（中）：
一种水性抛光组合物，其包含（A）研磨颗粒和（B）选自水溶性或水分散性表面活性剂的两亲性非离子表面活性剂，所述水性或水分散性表面活性剂具有（b1）疏水基团，所述支链烷基选自具有10〜 18个碳原子; 和（b2）选自包含（b21）氧化乙烯单体单元和（b22）取代的氧化烯单体单元的聚氧化烯基的亲水基团，其中取代基选自烷基，环烷基或芳基，烷基 - 环烷基， 烷基 - 芳基，环烷基 - 芳基和烷基 - 环烷基 - 芳基，所述含有单体单元（b21）和（b22）的聚氧化烯基以随机，交替，梯度和/或嵌段分布形式存在; 用于使用所述水性抛光组合物的具有图案化或未图案化的低k或超低k电介质层的衬底的CMP工艺; 以及使用所述水性抛光组合物制造电气，机械和光学装置。
IPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09G | 虫胶清漆除外的抛光组合物；滑雪屐蜡 |
| ------C09G1/00 | 抛光组合物 |
| --------C09G1/02 | .含有磨料或研磨剂 |