基本信息:
- 专利标题： PATTERN FORMING METHOD AND RESIST COMPOSITION
- 专利标题（中）：图案形成方法和阻力组成
- 申请号：PCT/JP2011/058376 申请日：2011-03-25
- 公开(公告)号：WO2011118855A1 公开(公告)日：2011-09-29
- 发明人： KATO, Keita , TARUTANI, Shinji , TSUCHIHASHI, Toru , KAMIMURA, Sou , ENOMOTO, Yuichiro , FUJII, Kana , IWATO, Kaoru , KATAOKA, Shohei , MIZUTANI, Kazuyoshi
- 申请人： FUJIFILM Corporation , KATO, Keita , TARUTANI, Shinji , TSUCHIHASHI, Toru , KAMIMURA, Sou , ENOMOTO, Yuichiro , FUJII, Kana , IWATO, Kaoru , KATAOKA, Shohei , MIZUTANI, Kazuyoshi
- 申请人地址： 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620 JP
- 专利权人： FUJIFILM Corporation,KATO, Keita,TARUTANI, Shinji,TSUCHIHASHI, Toru,KAMIMURA, Sou,ENOMOTO, Yuichiro,FUJII, Kana,IWATO, Kaoru,KATAOKA, Shohei,MIZUTANI, Kazuyoshi
- 当前专利权人： FUJIFILM Corporation,KATO, Keita,TARUTANI, Shinji,TSUCHIHASHI, Toru,KAMIMURA, Sou,ENOMOTO, Yuichiro,FUJII, Kana,IWATO, Kaoru,KATAOKA, Shohei,MIZUTANI, Kazuyoshi
- 当前专利权人地址： 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620 JP
- 代理机构： KURATA, Masatoshi et al.
- 优先权： JP2011-056712 20110315; JP2010-069670 20100325
- 主分类号： G03F7/038
- IPC分类号： G03F7/038 ; G03F7/039 ; G03F7/32 ; H01L21/027
摘要：
Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and ΔSP thereof represented by formula (1) below is 2.5 (MPa) 1/2 or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent. ΔSP=SP F -SP I •••(1)
摘要（中）：
提供了一种形成图案的方法，确保优异的曝光宽容度（EL）和聚焦纬度（焦深DOF）。 形成图案的方法包括（A）从抗蚀剂组合物形成膜，抗蚀剂组合物，（B）将膜曝光，和（C）使用含有有机溶剂的显影剂显影曝光膜，从而形成 负面模式。 抗蚀剂组合物含有（a）被酸分解时被分解的树脂，下式（1）表示的△SP为2.5（MPa）1/2以上，（b）构成的化合物 当暴露于光化射线或辐射时产生酸，和（c）溶剂。 SP = SPF-SPI°（1）