发明申请
WO2010107851A2 RAPID FABRICATION OF A MICROELECTRONIC TEMPORARY SUPPORT FOR INORGANIC SUBSTRATES
审中-公开
基本信息:
- 专利标题： RAPID FABRICATION OF A MICROELECTRONIC TEMPORARY SUPPORT FOR INORGANIC SUBSTRATES
- 专利标题（中）：无机衬底的微电子临时支持的快速制造
- 申请号：PCT/US2010/027560 申请日：2010-03-17
- 公开(公告)号：WO2010107851A2 公开(公告)日：2010-09-23
- 发明人： MOORE, John , HERMANOWSKI, James
- 申请人： SUSS MICROTEC, INC. , MOORE, John , HERMANOWSKI, James
- 申请人地址： 228 Suss Drive Waterbury Center, VT 05677 US
- 专利权人： SUSS MICROTEC, INC.,MOORE, John,HERMANOWSKI, James
- 当前专利权人： SUSS MICROTEC, INC.,MOORE, John,HERMANOWSKI, James
- 当前专利权人地址： 228 Suss Drive Waterbury Center, VT 05677 US
- 代理机构： COLLINS, Aliki, K.
- 优先权： US12/725,351 20100316; US61/160,738 20090317
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; B81C1/00
摘要：
A method for fabricating a rigid temporary support used for supporting inorganic substrates during processing includes providing an inorganic substrate comprising a first surface to be processed and a second surface opposite to the first surface. Next, applying a liquid layer to the second surface of the inorganic substrate and then curing the applied liquid layer and thereby forming a rigid temporary support attached to the second surface of the inorganic substrate. Next, processing the first surface of the inorganic substrate while supporting the inorganic substrate upon the rigid temporary support. The curing includes first exposing the applied liquid layer to ultraviolet (UV) radiation and then performing a post exposure bake (PEB) at a temperature sufficient to complete the curing of the applied liquid layer and to promote outgassing of substances.
摘要（中）：
制造用于在加工过程中支撑无机基材的刚性临时载体的方法包括提供包括第一待加工表面和与第一表面相对的第二表面的无机基材。 接下来，将液体层施加到无机基板的第二表面，然后固化所施加的液体层，从而形成附着到无机基板的第二表面的刚性临时支撑。 接下来，在刚性临时支撑件上支撑无机基板的同时处理无机基板的第一表面。 固化包括首先将施加的液体层暴露于紫外线（UV）辐射，然后在足以完成施加的液体层的固化并促进物质的除气的温度下进行后曝光烘烤（PEB）。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |