基本信息:
- 专利标题: ELECTROPLATING METHOD AND ELECTROPLATED PRODUCT
- 专利标题(中):电镀方法和电镀产品
- 申请号:PCT/CN2009/075555 申请日:2009-12-14
- 公开(公告)号:WO2010072121A1 公开(公告)日:2010-07-01
- 发明人: SUN, Jipeng , LI, Aihua , LI, Zaichun , PENG, Bo
- 申请人: BYD COMPANY LIMITED , SUN, Jipeng , LI, Aihua , LI, Zaichun , PENG, Bo
- 申请人地址: No.3001, Hengping Road Pingshan, Longgang Shenzhen, Guangdong 518118 CN
- 专利权人: BYD COMPANY LIMITED,SUN, Jipeng,LI, Aihua,LI, Zaichun,PENG, Bo
- 当前专利权人: BYD COMPANY LIMITED,SUN, Jipeng,LI, Aihua,LI, Zaichun,PENG, Bo
- 当前专利权人地址: No.3001, Hengping Road Pingshan, Longgang Shenzhen, Guangdong 518118 CN
- 代理机构: LIFANG & PARTNERS LAW FIRM
- 优先权: CN200810241685.3 20081226
- 主分类号: C25D5/10
- IPC分类号: C25D5/10 ; C25D5/44 ; C25D5/30
摘要:
A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu-Sn alloy layer onto the second copper layer from a Cu-Sn electroplating solution; and electroplating a chromium layer onto the Cu-Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.
摘要(中):
一种用于电镀具有铝合金表面的基板的方法包括:在铝合金表面上施加锌层; 从碱性铜电镀溶液中将第一铜层电镀到锌层上; 从酸性铜电镀溶液中将第二铜层电镀在第一铜层上; 从Cu-Sn电镀液中将Cu-Sn合金层电镀在第二铜层上; 并从三价铬溶液中将铬层电镀到Cu-Sn合金层上。 碱性铜电镀溶液基本上不含氰化物离子。
IPC结构图谱:
C | 化学;冶金 |
--C25 | 电解或电泳工艺;其所用设备 |
----C25D | 覆层的电解或电泳生产工艺方法;电铸;工件的电解法接合;所用的装置 |
------C25D5/00 | 以工艺方法为特征的电镀;工件的预处理或后处理 |
--------C25D5/10 | .一层以上相同金属或不同金属的电镀 |