基本信息:
- 专利标题: SOLDERING APPARATUS AND METHOD
- 专利标题(中):焊接设备和方法
- 申请号:PCT/CA2009/001849 申请日:2009-12-18
- 公开(公告)号:WO2010069066A1 公开(公告)日:2010-06-24
- 发明人: HALLÉE, Marc , CADORETTE, Luc
- 申请人: HALBERG DESIGN INC. , HALLÉE, Marc , CADORETTE, Luc
- 申请人地址: 4100, Matte Blvd. Brossard, Québec J4Y 2Z2 CA
- 专利权人: HALBERG DESIGN INC.,HALLÉE, Marc,CADORETTE, Luc
- 当前专利权人: HALBERG DESIGN INC.,HALLÉE, Marc,CADORETTE, Luc
- 当前专利权人地址: 4100, Matte Blvd. Brossard, Québec J4Y 2Z2 CA
- 代理机构: FASKEN MARTINEAU DuMOULIN LLP
- 优先权: US61/139,177 20081219
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; B23K1/00 ; B23K3/04 ; H05K13/00
摘要:
There is provided a method for soldering an electronic component to a circuit board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening defined in the circuit board. The method comprises preheating a lower end of the connector pin, applying flux on the lower end of the connector pin, heating a predetermined amount of soldering filler in a solid state over a cavity until it melts and inserting the lower end of the connector pin in the cavity containing the molten soldering filler, thereby soldering the electronic component to the circuit board. The predetermined amount of soldering filler may comprise a soldering filler bead. There is further provided an apparatus for soldering an electronic component to a circuit board. The apparatus comprise a board holder for holding the circuit board, a preheating assembly, a soldering filler dispensing assembly and a soldering assembly.
摘要(中):
提供了一种将电子部件焊接到电路板的方法,电子部件具有最初松动地接合在电路板中限定的销接收开口中的连接器销。 该方法包括预热连接器针脚的下端,在连接器针脚的下端上施加助焊剂,在空腔中以固态加热预定量的焊接填料,直到其熔化并将连接器针的下端插入 所述空腔包含熔融焊接填料,从而将电子部件焊接到电路板。 预定量的焊接填料可以包括焊接填料珠。 还提供了一种用于将电子部件焊接到电路板的装置。 该装置包括用于保持电路板的板保持器,预热组件,焊接填料分配组件和焊接组件。
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上,而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
----------H05K3/32 | ..电元件或导线与印刷电路的电连接 |
------------H05K3/34 | ...通过焊接的 |