基本信息:
- 专利标题： SUBSTRATE LAMINATION SYSTEM AND METHOD
- 专利标题（中）：基板层压系统和方法
- 申请号：PCT/US2009/031151 申请日：2009-01-15
- 公开(公告)号：WO2009091923A2 公开(公告)日：2009-07-23
- 发明人： BARNIDGE, Tracy, J. , NEMETH, Paul, R. , SAMPICA, James, D. , MARZEN, Vincent, P. , TCHON, Joseph, L.
- 申请人： ROCKWELL COLLINS, INC. , BARNIDGE, Tracy, J. , NEMETH, Paul, R. , SAMPICA, James, D. , MARZEN, Vincent, P. , TCHON, Joseph, L.
- 申请人地址： MS / 124-323 400 Collins Road NE Cedar Rapids, Iowa 52498 US
- 专利权人： ROCKWELL COLLINS, INC.,BARNIDGE, Tracy, J.,NEMETH, Paul, R.,SAMPICA, James, D.,MARZEN, Vincent, P.,TCHON, Joseph, L.
- 当前专利权人： ROCKWELL COLLINS, INC.,BARNIDGE, Tracy, J.,NEMETH, Paul, R.,SAMPICA, James, D.,MARZEN, Vincent, P.,TCHON, Joseph, L.
- 当前专利权人地址： MS / 124-323 400 Collins Road NE Cedar Rapids, Iowa 52498 US
- 代理机构： BECKER, Steven, C.
- 优先权： US12/009,375 20080118; US12/009,472 20080118; US12/009,373 20080118; US12/009,393 20080118; US12/009,372 20080118; US12/009,482 20080118
- 主分类号： G02F1/13
- IPC分类号： G02F1/13 ; H05B33/10 ; H01L51/50 ; B32B7/06
摘要：
A method for laminating substrates may include disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate, disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber, evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.
摘要（中）：
用于层压基板的方法可以包括在第一基板的基本上平坦的表面和第二基板的基本平坦的表面之间设置压敏粘合剂层，设置第一基板，压敏 粘合剂层和第二衬底在真空室内，抽空真空室，并向第一衬底和第二衬底中的至少一个施加压力。