发明申请
WO2009090349A2 METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNECTION MEMBER
审中-公开
基本信息:
- 专利标题： METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNECTION MEMBER
- 专利标题（中）：制造电气机械互连构件的方法
- 申请号：PCT/FR2008001497 申请日：2008-10-24
- 公开(公告)号：WO2009090349A2 公开(公告)日：2009-07-23
- 发明人： SIMON PATRICE , TABERNA PIERRE-LOUIS , LEBEY THIERRY , CAMBRONNE JEAN PASCAL , BLEY VINCENT , LUAN QUOC HUNG , TARASCON JEAN MARIE
- 申请人： CENTRE NAT RECH SCIENT , UNIV TOULOUSE , SIMON PATRICE , TABERNA PIERRE-LOUIS , LEBEY THIERRY , CAMBRONNE JEAN PASCAL , BLEY VINCENT , LUAN QUOC HUNG , TARASCON JEAN MARIE
- 专利权人： CENTRE NAT RECH SCIENT,UNIV TOULOUSE,SIMON PATRICE,TABERNA PIERRE-LOUIS,LEBEY THIERRY,CAMBRONNE JEAN PASCAL,BLEY VINCENT,LUAN QUOC HUNG,TARASCON JEAN MARIE
- 当前专利权人： CENTRE NAT RECH SCIENT,UNIV TOULOUSE,SIMON PATRICE,TABERNA PIERRE-LOUIS,LEBEY THIERRY,CAMBRONNE JEAN PASCAL,BLEY VINCENT,LUAN QUOC HUNG,TARASCON JEAN MARIE
- 优先权： FR0707566 2007-10-26
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/02 ; H01L21/60 ; H01L23/49 ; H01L25/065 ; H01R4/26
摘要：
The invention relates to a method for making an electrically-conducting mechanical interconnection member (12), that comprises: a first phase of electrochemical deposition of a structure including a plurality of metal wires (2a) having a sub-micrometric diameter and protruding from the surface of a substrate (2) also made of metal; and a second phase for the controlled and partial dissolution of said wires in order to reduce the diameter thereof. The invention also relates to a method for making a mechanical and/or electric interconnection, that comprises the steps of: making two interconnection members according to the method mentioned above; and positioning the interconnection members face to face and pressing them against each other in order to carry out an interpenetration and an entanglement of the nanometric wires protruding from the surfaces of said members. The invention also relates to a three-dimensional electronic device including a stack of micro-electronic chips mechanically and electrically connected together by such interconnection members.
摘要（中）：
本发明涉及一种用于制造导电机械互连构件（12）的方法，该方法包括：包括多个金属线（2a）的结构的电化学沉积的第一阶段，其具有亚微米直径并从 也由金属制成的基板（2）的表面; 以及用于所述电线的受控和部分溶解以减小其直径的第二相。 本发明还涉及一种用于制造机械和/或电互连的方法，其包括以下步骤：根据上述方法制造两个互连构件; 并且将互连构件面对面地定位并将它们彼此挤压，以便执行从所述构件的表面突出的纳米线的相互渗透和缠结。 本发明还涉及一种三维电子设备，其包括通过这种互连构件机械和电连接在一起的微电子芯片堆叠。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |