基本信息:
- 专利标题： QUARTZ SAW SENSOR BASED ON DIRECT QUARTZ BONDING
- 专利标题（中）：基于直接石英结合的QUARTZ SAW传感器
- 申请号：PCT/US2007000988 申请日：2007-01-12
- 公开(公告)号：WO2007084434A3 公开(公告)日：2007-10-11
- 发明人： COBIANU CORNEL P , AVRAMESCU VIOREL V , GEORGESCU ION
- 申请人： HONEYWELL INT INC , COBIANU CORNEL P , AVRAMESCU VIOREL V , GEORGESCU ION
- 专利权人： HONEYWELL INT INC,COBIANU CORNEL P,AVRAMESCU VIOREL V,GEORGESCU ION
- 当前专利权人： HONEYWELL INT INC,COBIANU CORNEL P,AVRAMESCU VIOREL V,GEORGESCU ION
- 优先权： US33163206 2006-01-13
- 主分类号： G01L9/00
- IPC分类号： G01L9/00
摘要：
A SAW sensor module can be produced with a true all quartz sensor package (TAQSP) attached to a substrate. The TAQSP has a quartz cover direct quartz bonded to a SAW sensor on a quartz substrate. The TAQSP can be mass produced by direct quartz bonding a quartz cover wafer, having many covers, to a quartz sensor wafer, having many sensors, thereby producing a wafer tandem. The wafer tandem can be further processed because the bond protects the sensors within. Individual sensor packages can be obtained by cutting stripes out of the cover wafer, revealing SAW sensor bonding pads, and then dicing the wafer tandem. A SAW sensor module results when the sensor packages are attached to an antenna bearing substrate and then sealed.
摘要（中）：
SAW传感器模块可以使用真正的全石英传感器封装（TAQSP）连接到衬底上。 TAQSP将石英盖直接石英结合到石英衬底上的SAW传感器上。 TAQSP可以通过将具有许多盖的石英盖晶片直接石英键合到具有许多传感器的石英传感器晶片来批量生产，由此产生晶片串联。 晶圆串联可以进一步处理，因为键保护内部的传感器。 单个传感器封装可以通过从盖晶片上切割出条纹，显露SAW传感器焊盘，然后将晶片切割成串联来获得。 当传感器封装连接到天线支承基板上然后密封时，会产生SAW传感器模块。