An electronic component package and a method of forming the package are disclosed. The package includes a die having a top face with set of contacts and a substrate having a cutout therein. The die may include a memory component and may include SDRAM. The substrate is mounted on the top face, and the cutout overlays the set of contacts. Wire leads extend from the set of contacts, at least partially through the cutout, to the substrate. The set of contacts may be positioned along a central region of the die, and the cutout overlays the central region. The wire leads extend to the substrate and may contact the substrate proximate to the cutout. The package may further include a set of electrical paths extending from the wire leads through the substrate for providing communicative path between the die and an external component.