基本信息:
- 专利标题: セラミック部品とその製造方法
- 专利标题(英):Ceramic component and production method therefor
- 专利标题(中):陶瓷组件及其生产方法
- 申请号:PCT/JP2002/006077 申请日:2002-06-18
- 公开(公告)号:WO2003000619A1 公开(公告)日:2003-01-03
- 发明人: 勝村 英則 , 齊藤 隆一 , 若林 都加佐 , 加賀田 博司
- 申请人: 松下電器産業株式会社 , 勝村 英則 , 齊藤 隆一 , 若林 都加佐 , 加賀田 博司
- 申请人地址: 〒571-8501 大阪府 門真市 大字門真1006番地 Osaka JP
- 专利权人: 松下電器産業株式会社,勝村 英則,齊藤 隆一,若林 都加佐,加賀田 博司
- 当前专利权人: 松下電器産業株式会社,勝村 英則,齊藤 隆一,若林 都加佐,加賀田 博司
- 当前专利权人地址: 〒571-8501 大阪府 門真市 大字門真1006番地 Osaka JP
- 代理机构: 岩橋 文雄
- 优先权: JP2001-190966 20010625
- 主分类号: C04B35/64
- IPC分类号: C04B35/64
摘要:
A high−reliability, high−dimension−accuracy ceramic component having electric characteristics thereof not significantly deteriorated and defects such as cracks restricted in the vicinity of an internal electrode in a substrate after firing when subjected to a high−dimension−accuracy firing method in which a glass ceramic laminate is fired while being held between heat shrinkage restricting sheets. A method of producing a ceramic component comprising the conductor printing step of printing on a glass ceramic green sheet a conductor paste having a sintering speed equivalent to that of the glass ceramic green sheet, the laminating step of laminating a plurality of the glass ceramic green sheets to form a laminate, a composite laminating step of further laminating on the one or both surfaces of the laminate heat shrinkage restricting green sheets mainly containing inorganic matters, a binder removing step of removing by burning organic matters from the composite laminate, the firing step of sintering the organic matter−removed composite laminate with sintering behaviors of the glass ceramic green sheets and the conductor paste matched, and the step of removing inorganic matters in the heat shrinkage green sheets.
摘要(中):
具有电特性的高可靠性,高精度的陶瓷部件在经受高温精度烧制方法后,在烧结后的基板内部电极附近不会明显劣化,例如裂纹等缺陷受到限制,其中, 在保持在热收缩限制片之间的同时烧制玻璃陶瓷层叠体。 一种陶瓷部件的制造方法,其特征在于,包括:导体印刷工序,在玻璃陶瓷生片上印刷烧结速度与玻璃陶瓷生片的烧结速度相同的导体糊料,层叠多个玻璃陶瓷生片 形成层叠体,在主要含有无机物的叠层热收缩限制生片的一面或两面进一步层叠的复合层叠工序,通过从复合层叠体中烧成有机物去除的粘合剂除去工序, 通过玻璃陶瓷生片和导体糊的烧结特性烧结有机物去除复合层压体,以及除去热收缩生片中的无机物的步骤。