发明申请
WO01086716A1 SEMICONDUCTOR DEVICE MOUNTING CIRCUIT BOARD, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING MOUNTING STRUCTURE USING THE SAME
审中-公开
基本信息:
- 专利标题： SEMICONDUCTOR DEVICE MOUNTING CIRCUIT BOARD, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING MOUNTING STRUCTURE USING THE SAME
- 专利标题（英）：Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
- 专利标题（中）：半导体装置安装电路板及其制造方法以及使用该方法生产安装结构的方法
- 申请号：PCT/JP2001/003922 申请日：2001-05-11
- 公开(公告)号：WO01086716A1 公开(公告)日：2001-11-15
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/498 ; H05K3/32 ; H01L23/29
摘要：
A semiconductor mounting structure which does not cause characteristic degradation of semiconductor devices, wire breakage of wiring, or the like during mounting of semiconductor devices on circuit boards. A mounting structure comprising a circuit board with a semiconductor device mounted thereon, wherein a projecting electrode of the semiconductor device is arranged on the input/output terminal electrode of the circuit board and bonded thereto for electric and mechanical connection by a conductive adhesive, and the semiconductor device and circuit board are fixedly bonded by a resin film preformed on the board surface. This enables mounting without causing damage to the semiconductor functional parts or wiring and with lower load than in the conventional anisotropic conductive film; therefore, high-productivity low-cost thermo-compression bonding mounting can be applied.
摘要（中）：
一种半导体安装结构，其在半导体器件安装在电路板上时不会引起半导体器件的特性劣化，布线断线等。 一种安装结构，包括其上安装有半导体器件的电路板，其中半导体器件的突出电极布置在电路板的输入/输出端子电极上并被接合以通过导电粘合剂进行电气和机械连接，并且 半导体器件和电路板通过在板表面上预先形成的树脂膜固定地结合。 这使得安装不会损害半导体功能部件或布线并且具有比常规各向异性导电膜更低的负载; 因此，可以应用高生产率低成本的热压粘合安装。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/56 | ....封装，例如密封层、涂层 |