A miniature or subminiature incandescent lamp designed to operate with an energy source of 20 volts or less includes a filament enclosed in a first glass envelope and supported by a pair of metal contact pins. A first glass bead seals the envelope and has a pair of openings through which the metal contact pins penetrate and wherein they are hermetically sealed. A second glass bead of low melting solder glass is larger than the first bead and is sealed below the first bead and extends circumferentially beyond the perimeter of the first bead. A third bead of high melting glass is disposed below the second bead also in sealing relationship with the second bead. The outside perimeter of the third bead is substantially co-extensive with that of the second bead. A second glass envelope is sealed to the outside perimeter of the second bead and is also in abutting relationship with the third bead. The interior of the first envelope is evacuated or contains an inert gas of the type normally used in incandescent lamps. The interior hermetically sealed space between the first and second envelopes is also evacuated, filled with an inert gas or with nitrogen. The resulting miniature and subminiature lamps have operating exterior surface temperatures which do not exceed 160 DEG C.