发明申请
WO9924498A3 METHODS AND APPARATUS FOR BONDING DEFORMABLE MATERIALS HAVING LOW DEFORMATION TEMPERATURES
审中-公开
基本信息:
- 专利标题： METHODS AND APPARATUS FOR BONDING DEFORMABLE MATERIALS HAVING LOW DEFORMATION TEMPERATURES
- 专利标题（中）：用于连接具有低变形温度的可变形材料的方法和装置
- 申请号：PCT/US9823907 申请日：1998-11-06
- 公开(公告)号：WO9924498A3 公开(公告)日：2000-01-27
- 发明人： KILGORE BRUCE J , MCKNIGHT THOMAS , O'MOHUNDDRO ROY LYNN , BATTISTA JOHN A JR , PETRUCCI RICHARD J
- 申请人： NIKE INC , NIKE INTERNATIONAL LTD
- 专利权人： NIKE INC,NIKE INTERNATIONAL LTD
- 当前专利权人： NIKE INC,NIKE INTERNATIONAL LTD
- 优先权： US96553297 1997-11-06
- 主分类号： C08J5/12
- IPC分类号： C08J5/12 ; A43B9/12 ; A43D25/20 ; B29C65/00 ; B29C65/14 ; B29C65/48 ; B29C65/78 ; B30B5/02 ; C08J7/00 ; C09J5/06 ; C09J201/00 ; H05B6/64
摘要：
Systems, methods and apparatus are disclosed for bonding a plurality of substrates via a solventless, curable adhesive. At least one of the substrates has a deformation temperature below the activation temperature of the adhesive. A workpiece is assembled from a plurality of substrates with the curable adhesive disposed therebetween. Pressure is applied to the workpiece and the workpiece is irradiated with variable frequency microwave energy. The workpiece is swept with at least one window of microwave frequencies selected to heat the adhesive without heating the substrates above their respective deformation temperatures.
摘要（中）：
公开了用于通过无溶剂的可固化粘合剂粘合多个基底的系统，方法和装置。 至少一个基板的变形温度低于粘合剂的活化温度。 工件由多个基板组装，固化粘合剂位于它们之间。 对工件施加压力，用可变频率的微波能量照射工件。 工件被扫描至少一个选定的微波频率窗口以加热粘合剂，而不将基板加热到高于其各自的变形温度。