Heat-resistant molding resin composition composed of 60-99.9 weight% of an aromatic polyamide resin and 40-0.1 weight% of at least one thermoplastic resin having a melt viscosity of not more than 1 x 105 poises and a decomposition point not lower than 350`C and being selected from the group consisting of polyphenylenesulfide resin, polyamide resin, polysulfone resin, aromatic polyester resin, polyphenylene ether resin, and phenoxy resin. The addition of the thermoplastic resin serves to improve melt fluidity of aromatic polyamidoimide resin and permits a resin composition having good molding properties to be obtained. This composition can contain various fillers. Moldings obtained by melt-molding this composition are excellent in heat resistance, mechanical characteristics, electric characteristics, sliding characteristics, solvent resistance, etc., and have a wide range of applications.