基本信息:
- 专利标题： Method and arrangement for attaching a chip to a printed conductive surface
- 申请号：US16007530 申请日：2018-06-13
- 公开(公告)号：USRE48018E1 公开(公告)日：2020-05-26
- 发明人： Juha Maijala , Petri Sirviö
- 申请人： Juha Maijala , Petri Sirviö
- 申请人地址： FI Kellokoski
- 专利权人： Juha Maijala,Petri Sirviö
- 当前专利权人： Juha Maijala,Petri Sirviö
- 当前专利权人地址： FI Kellokoski
- 代理机构： Patterson Thuente Pedersen, P.A.
- 国际申请： PCT/FI2010/050797 2010.10.14
- 国际公布： WO2012/049352A 2012.04.19
- 进入国家日期： 2013-06-14
- 主分类号： H05K3/30
- IPC分类号： H05K3/30 ; B23K1/00 ; H05K1/00 ; H05K3/32 ; H05K3/34 ; H05K13/04 ; H05K3/12
摘要：
A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/30 | .用电元件组装印刷电路的，例如用电阻 |